The Countdown: Why This Project, Why Now?

• What is the single most important outcome you need from this assembly run? Options: Prototype validation (fit/function), Supplier trial for qualification, Short-term bridge inventory, Pre-production verification for product review, Other
• When is your prototype or review deadline? (please give a calendar date or number of business days)
• How many assembled boards do you need in this first trial? Options: 1–5, 6–10, 11–20, 21–50, More than 50
• How fast does this need to ship to meet your timeline? Options: 3 business days, 5 business days, 7–10 business days, 2+ weeks, No firm deadline
• Who on your team will own acceptance and sign-off for this trial (name & role)?
• Which stakeholders should we include in status updates and design-for-manufacturability (DFM) feedback? Options: Design Engineer, Hardware Lead/Architect, Supply Chain/Procurement, QA/Compliance, Program Manager, Other

If This Trial Doesn’t Go Well, What Breaks First?

• If the trial misses your expectations, what’s the real consequence for your project—delay, budget overrun, reputational risk, or something else? Options: Delay to validation/launch, Increased NRE or rework cost, Supply chain requalification, Loss of stakeholder confidence, Other
• Tell us about a past supplier failure that mattered—what happened, and how did your team respond?
• How long can the program absorb a missed prototype deadline before it impacts the product review or release? Options: Less than 1 week, 1–2 weeks, 2–4 weeks, More than a month, Unsure
• What would have to be true for you to feel the trial was a failure versus a learning step?
• How does a past negative experience with assembly vendors make you feel about switching or trying a new provider? Options: Wary — need lots of proof, Open if risk is mitigated, Neutral, Excited to try a better partner

Where Is Your Board Most Fragile—and Why That Matters

• Which of these tight tolerances or components are present on this board? Options: Fine-pitch BGA (≤0.5mm), 0201 passives, Micro-BGA/CSP, Large BGAs with thermal vias, Fine-pitch QFP, Connector with press-fit pins, Heavy copper or odd-stackup
• Have you seen yield or inspection problems on similar boards before? If so, describe the failure modes and frequency.
• Do you have special assembly requirements we should know about (e.g., bottom-side components, double-reflow, selective wave, conformal coat)? Options: Bottom-side components, Double-reflow/BGA reflow sequencing, Selective wave solder, Conformal coating/underfill, Glue dispensing/curing, No special requirements, Other
• How mature is your BOM and PCB documentation (Gerbers, ODB++, pick-and-place, 3D models, clear polarity markings)? Options: Complete and validated, Mostly complete with gaps, Preliminary — will evolve, Sparse — need help specifying
• Are there known DFM risks you want prioritized (thermal reliefs, constrained stencil aperture, long trace lengths, lack of test points)?

Who’s Bringing the Parts—and What Happens If They’re Late?

• Who will be responsible for component sourcing for the trial run? Options: You (Customer ships full kit), We (Host source via preferred distributors), Split responsibility (you ship critical parts), Third-party kitting/CM, Other
• If a critical component is long-lead or allocated, how do you typically want us to handle it? Options: Use approved alternates, Hold assembly until part arrives, Source alternative vendors and seek approval, Customer supplies replacement, Discuss case-by-case
• What are your approval rules for part substitutions (who signs off, documentation required)?
• How do you prefer to share kits and documentation with us (ship-to, upload BOM to portal, vendor-managed inventory)? Options: Ship full kitted parts, Upload BOM & let host source, Both (host sources some items), Vendor-managed inventory (VMI), Other
• Have you ever had an assembly delayed by a wrong part or footprint mismatch? Tell us what we should watch for on this BOM.

What Does ‘Acceptable’ Look Like Under the Microscope?

• What IPC workmanship level are you expecting for this build? Options: IPC Class 2 (commercial), IPC Class 3 (high-reliability), Do not know — would like guidance, Custom internal spec
• What inspection methods will you use to evaluate the trial (manual microscope, X-ray, AOI, functional test)? Options: Manual optical with magnification, AOI, X-ray / BGA inspection, Functional/ICT testing, Customer onsite inspection, Other
• What are your minimum acceptable yield and defect rates for this trial? Options: >98% yield, >95% yield, Accept lower yield if failures are documented, No preset target — want to understand failures
• Are there specific acceptance tests or metrics that must pass before you’ll approve a production transition (thermal cycling, solder fillet photos, electrical bench test)?
• How will you document and sign off on acceptance—photos, inspection reports, written approval, or shipment hold until in-person check? Options: Digital inspection report + photos, Formal sign-off from QA, Onsite inspection by customer, Shipment hold until approval, Other

If We Become Your Long-Term Partner, What Would Change?

• What about your current supply chain or assembler relationship frustrates you enough to consider switching?
• What would success look like three months after transitioning from prototype to weekly production with us? Options: Consistent on-time weekly shipments, Stable yield at target, No rework / minimal escapes, Clear traceability and documentation, Seamless communication
• Which certifications or traceability features are non-negotiable for your program? Options: IPC Class 3 workmanship, ISO 9001, AS9100, ITAR/EAR compliance, RoHS/REACH traceability, Lot-level traceability with genealogy
• What concerns you most about moving a successful prototype to low-volume production (process drift, operator variability, supply continuity, cost creep)?
• Imagine we nailed the first trial—what would you want our role to be in the first 30–90 days of production? Options: Daily monitoring and reports, Weekly yield review, Onsite support during ramp, Remote engineering support, Quarterly business reviews

Deciding Together: What Would Make You Pull the Trigger?

• What are the must-have items we must deliver in the proposal to win this trial (pricing, lead time, inspection evidence, sourcing SLA)?
• What commercial or contractual steps speed your internal approval (NDA, sample agreement, PO, pilot contract)? Options: Signed NDA, Statement of Work / pilot contract, Purchase Order, Quote + lead-time confirmation, Other
• Which contingencies do you need in place before we start (spare parts, alternate components, agreed rework allowances)? Options: Spare parts kit, Approved alternates list, Defined rework budget, Escalation path & SLA, Other
• How would you like us to communicate during the trial—frequency and channels (daily digest, real-time portal updates, weekly call)? Options: Real-time portal updates, Daily email digest, Weekly sync call, Ad-hoc calls for issues, Onsite updates
• Realistically, what would be a comfortable next step and timeline to get started (send NDA, schedule kickoff call, submit kit by X date)? Options: Send NDA / legal steps, Schedule 30–60 minute kickoff, Customer ships kit within a week, Host sources parts and confirms lead times, Other

• Trial Kickoff & Current-State Alignment
• Pre-Trial Readiness & DFM Sign-off
• Trial Execution Planning & Inspection Protocols
• Run-day In-Process Checkpoint
• Post-Trial Review: Results, Root Cause & Decision

• Capture and store FAI images and measurement logs to the shared trial report folder.
• Define the exact data capture format so results are comparable and auditable.
• Set clear escalation thresholds to prevent wasted production if the trial fails early.
• Prepare FAI checklist, image naming convention, and report template.
• Program reflow profile and confirm stencil/paste settings on the line.
• Assign inspectors and reserve microscopy and X-ray time slots for the run.
• Document contingency steps and confirm notification list for escalation triggers.
• FAI Review & Approval
• Approve the FAI so the trial can proceed with evidence-based confidence.
• Detect and act on early defect trends to avoid repeating failure across the build.
• Ensure data capture is functioning so post-trial analysis will be complete and auditable.
• Introductions & Objectives
• Implement agreed parameter adjustments and log the changes with timestamps.
• If halted, document immediate root-cause hypotheses and owners for full RCA.
• Send a run-status update to stakeholders summarizing the checkpoint decision.
• Executive Summary & KPIs
• Validate with objective evidence whether the trial proved the agreed future-state outcome.
• Agree on required design or process changes and the remediation path if acceptance was not met.
• Decide and document the next commercial/operational step (production transition, repeat trial, or remediation), with owners and timelines.
• Produce a distributable trial report that serves as the single source of truth for decisions.
• Publish the formal trial report including images, KPI dashboard, and signed acceptance status.
• List required PCB, BOM, or process changes with owners and target dates for remediation verification.
• If accepted, prepare a production transition checklist and preliminary weekly schedule proposal.
• If remediation required, schedule follow-up trial or corrective actions and assign RCA owners.
• Produce a crystal-clear one-sentence current-state statement agreed by both parties.
• Surface and quantify the consequence of failure in operational terms.
• Agree a one-sentence future-state (outcome) and explicit success signals the trial must validate.
• Confirm roles, observers, and the trial timeline so responsibilities are unambiguous.
• Document and circulate the 1-sentence current-state and quantified consequence.
• Publish the agreed one-sentence future-state and the success/acceptance criteria to the trial packet.
• List attendees and sign-off authorities for the trial and confirm availability on run dates.
• Flag any known schedule or parts risks and assign owners to resolve before the pre-trial readiness meeting.
• BOM & Part Cross-check
• Confirm every BOM item and identify any part gaps or substitution decisions.
• Lock DFM mitigations that will be tested during the trial and prevent scope creep.
• Agree on inspection methods and microscopy requirements that constitute pass/fail.
• Obtain stakeholder sign-off on the readiness checklist so the trial moves forward with clear ownership.
• Resolve any BOM gaps and update the parts-kitting list with owners and ETA.
• Produce a DFM action log noting mitigations to be tested and assign engineers.
• Create and share the pre-trial kit and inspection checklist for shop-floor use.
• Obtain written sign-off from the customer on accepted substitutions and inspection criteria.
• Trial Sequence & Timing
• Finalize line setup and process parameters that will be used to prove the future state.
• Agree an FAI and sampling plan that produces objective pass/fail evidence.
• Line Setup & Process Parameters
• Visual Solder Quality Review
• One-sentence Current State
• Early Defect Trend Check
• Gerber, Assembly & Stencil Review
• Immediate Adjustments
• Consequence Assessment
• DFM Findings & Required Changes
• First-Article Inspection (FAI) Plan
• Component Sourcing & Kitting Status
• Root Cause Analysis & Mitigation Plan
• Sampling, Yield Metrics & Pass/Fail Criteria
• One-sentence Future State
• DFM Risk Items & Agreed Mitigations
• Data Capture Validation
• Decision & Next Steps

• Quick-turn Prototype SMT Assembly (3–5 business days)
• Small-volume Production SMT Runs
• Through-hole and Mixed-Technology Assembly
• Component Procurement and Kitting
• Stencil Fabrication and Solder Paste Application
• Fine-pitch BGA Placement and Reflow
• Micro-SMT Placement (0201/01005)
• Controlled Reflow Soldering with Profiling
• Wave and Selective Soldering for Through-hole
• Automated Optical Inspection (AOI) of Assemblies
• Automated X-ray Inspection (AXI) for BGAs
• In-Circuit Test (ICT) and Flying Probe Testing
• Conformal Coating and Potting
• Repair, Rework, and BGA Reballing
• Serialization, UID Marking, and Traceability Labels

Quick-turn Prototype SMT Assembly (3–5 business days)

• Do you require a quick-turn prototype SMT assembly service for this project? Options: Yes, No
• What is your target turn time for prototypes? Options: 3 business days, 4 business days, 5 business days, Flexible / longer
• How many prototype boards do you need in this run? Options: 1-2, 3-5, 6-10, 11-25
• Do you require DFM feedback and a post-build report with photos/magnified solder images? Options: Yes, include DFM feedback, No, not required
• List any high-risk features on the board (e.g., fine-pitch BGA pitch, 0201 passives, odd form components) and any assembly notes or constraints.

Small-volume Production SMT Runs

• Are you planning to scale to regular small-volume production after prototyping? Options: Yes — weekly schedule, Yes — monthly batches, No
• What steady-state weekly or monthly quantities are you targeting? Options: 10-99 / week, 100-999 / week, 1,000-4,999 / week, Custom (describe)
• Do you require the production to be on the same line/process used for prototyping to avoid re-qualification? Options: Yes, No / flexible
• Which acceptance criteria and yield targets must be met before full ramp? Options: IPC Class 2 yield target, IPC Class 3 yield target, Customer-defined yield (%), Other (describe)
• Are there required weekly delivery windows or supplier SLAs for inbound components during production? Options: Yes — define SLAs, No — flexible

Through-hole and Mixed-Technology Assembly

• Does your design include through-hole or mixed-technology (SMD + through-hole) processes? Options: Yes — through-hole present, No — SMT only
• What proportion of assembly is through-hole (approximate percent of BOM or number of holes)? Options: <10%, 10-30%, 30-60%, >60%
• Do you require wave soldering, selective soldering, or manual hand-soldering for specific assemblies? Options: Wave soldering, Selective soldering, Hand soldering only, Combination — specify areas
• Are there special fixtures, conformal coating masks, or component placement constraints for mixed assemblies? Options: Yes — will provide details, No
• Please describe any insertion orientation, polarity critical connectors, or through-hole plating/finish requirements.

Component Procurement and Kitting

• Will you supply parts (consigned) or require the assembler to procure components? Options: Customer-supplied (kitted), Assembler-procured, Mixed (some customer, some procured)
• If assembler-procured, what is the acceptable sourcing lead time and approved distributors list? Options: Standard lead times OK, Need expedited sourcing, Only approved distributors (list)
• Do you require country-of-origin documentation, RoHS/REACH certificates, or lot traceability for all components? Options: Yes — full traceability & certificates, Partial (critical components only), No
• How should kitted components be packaged and labeled on receipt (e.g., reel, tray, bag; UID or lot labels)? Options: Standard reels/trays with lot labels, Customer preference — describe, No preference
• Are there long-lead or allocated components that require purchase approvals or alternate sourcing strategies? Options: Yes — approval required, No

Stencil Fabrication and Solder Paste Application

• Do you require stencil fabrication services and/or stencil design review? Options: Yes — new stencil, No — customer supplies stencil, Yes — review only
• What aperture definition or solder paste type is recommended for your design (lead-free, no-clean, high-tack)? Options: Lead-free no-clean, Leaded paste, High-tack paste, Unsure — need recommendation
• Do you have special paste deposition requirements (pin-in-paste, void reduction, paste on BGA pads)? Options: Yes — specify, No
• What stencil material/thickness do you require or prefer for fine-pitch areas? Options: Stainless 0.1mm, Stainless 0.12mm, Electroformed thinner gates, Unsure — advise
• Are first-article paste prints and profiling required to validate solder paste application before population? Options: Yes — require sample prints, No

Fine-pitch BGA Placement and Reflow

• Does your assembly include fine-pitch BGAs or LGA devices requiring AXI and advanced placement? Options: Yes — BGA present, No
• What is the smallest ball pitch or BGA land pitch (e.g., 0.4 mm, 0.5 mm)? Options: ≤0.4 mm, 0.45–0.5 mm, >0.5 mm, Unknown — provide drawings
• Do you require controlled reflow profiles and thermal profiling for BGA assemblies? Options: Yes — profiling required, No — standard profile OK
• Are post-reflow AXI inspections and reporting required for BGAs? Options: Yes — AXI and report, No — AOI only, Conditional — only on critical lots
• List any underfill, heat-sink attachment, or shielding operations associated with the BGA devices.

Micro-SMT Placement (0201/01005)

• Does your BOM include micro-SMT parts such as 0201 or 01005 passives? Options: Yes — 0201, Yes — 01005, No
• Are there placement accuracy or fiducial requirements beyond standard tolerances? Options: Yes — specify tolerances, No — standard tolerances OK
• Do you require specialized feeders (tape-on-reel vs. custom tray) or component handling instructions? Options: Yes — will provide details, No — standard feeders OK
• Are magnified inspection images and placement offset reports required after assembly? Options: Yes — include images, No
• Do you expect iterative tuning runs for placement yield, and how many iterations are acceptable before production? Options: 1 tuning run, 2 tuning runs, 3+ tuning runs, Not acceptable — must be right first run

Controlled Reflow Soldering with Profiling

• Do you require controlled reflow soldering with thermal profiling and documented profiles? Options: Yes — profiles required, No — standard process OK
• What solder alloy and process (lead-free, SnPb) does your assembly require? Options: Lead-free (e.g., SAC305), SnPb, Mixed (specify)
• Are there specific ramp/soak/peak temperature constraints or thermal mass concerns on your board? Options: Yes — provide constraints, No
• Do you require per-lot reflow profile validation and signed thermal reports for traceability? Options: Yes — per-lot, No — initial qualification only
• Are multi-stage reflow processes or nitrogen-assisted reflow needed for this design? Options: Yes — nitrogen or multi-stage, No

Wave and Selective Soldering for Through-hole

• Do any assemblies require wave or selective soldering for through-hole components? Options: Yes — wave solder, Yes — selective solder, No
• Are there heat-sensitive components or pre-assembly constraints for wave soldering areas? Options: Yes — list components, No
• Do you need protective fixtures, masking, or shielding for mixed wave/SMT processes? Options: Yes — will provide specs, No
• What solder alloy and flux type is required for through-hole operations? Options: Lead-free wave, SnPb wave, Selective flux — specify
• Do you require post-solder inspection (visual/AOI/functional) specifically for through-hole joints? Options: Yes — specify method, No

Automated Optical Inspection (AOI) of Assemblies

• Should AOI be applied to every board or a sampling plan (e.g., first-article, per-lot)? Options: 100% AOI, Sampling plan (specify), First-article only
• Which defect classes are highest priority to catch with AOI (solder bridges, tombstones, misalignment, missing components)? Options: Solder bridges, Missing components, Tombstoning, Misalignment, All of the above
• Do you require annotated AOI reports and images included with shipment documentation? Options: Yes — include images, No
• Are there special AOI recipes needed for fine-pitch or odd-form parts? Options: Yes — will provide examples, No
• If AOI exceptions are found, should boards be held for customer approval, reworked, or scrapped? Options: Hold for approval, Rework per repair policy, Scrap

Automated X-ray Inspection (AXI) for BGAs

• Do you require AXI for BGA and hidden-joint inspection? Options: Yes — AXI required, No — AXI on request, No
• Should AXI be performed 100% or by sampling (e.g., critical boards only)? Options: 100% AXI, Sampling plan, Critical lots only
• Do you need AXI images and voiding/shift metrics included in the lot report? Options: Yes — include AXI report, No
• Are there specific AXI acceptance criteria (void < X%, no gross shift > Y mm)? If yes, specify.
• Will AXI failures trigger rework/reflow, or should failed boards be quarantined for customer review? Options: Automatic rework, Quarantine for customer review, Case-by-case

In-Circuit Test (ICT) and Flying Probe Testing

• Do you require ICT or flying-probe testing for functional or netlist checks? Options: ICT, Flying Probe, Both, None
• Do you have existing test programs (CAD/bed-of-nails) or need test development? Options: Existing test programs, Need test development, Flying probe only — no program needed
• What are the pass/fail criteria for electrical tests (e.g., shorts, opens, specific param thresholds)?
• Is functional test with power-up and smoke test required as part of ICT/flying-probe? Options: Yes — functional power-up, No
• How should test failures be reported and handled (repair, remake, customer authorization)? Options: Repair per policy, Remake, Hold and notify customer

• Statement of Work (SOW)
• Master Services / Manufacturing Agreement (MSA)
• Commercial Terms & Pricing Schedule
• Purchase Order — Trial Build
• Lead Times & Delivery Schedule
• Component Sourcing Agreement
• Sourcing SLA & Shortage Handling
• Trial Acceptance Criteria & Test Plan
• Quality & Certification Confirmation
• Transition & Weekly Production Plan
• Change Order & Engineering Change Control
• Payment Terms & Deposit Authorization
• Warranty, Liability & RMA Terms
• Escalation & Communication Protocol
• Shipping, Logistics & Incoterms
• Export, Compliance & Data Rights

• Success Review & Acceptance
• Production Transition Approval (Operational & Commercial Signoff)
• Operational Handover & Process Control
• Shared Channel, Issue Triage & Escalation Setup
• Post-Transition Performance Review (30/90 Day Checkpoints)

• Provision the agreed shared channel, invite stakeholders, and publish triage & escalation cheat-sheet.
• Confirm IPC Class 3 inspection workflows and rework rules are unambiguous and documented.
• Establish complete traceability and documentation templates that satisfy customer audit requirements.
• Schedule and assign training with completion dates for all involved operators/engineers.
• Finalize and publish work instructions, inspection checklists, and traceability template to the shared folder.
• Complete operator/engineer training and collect sign-off records prior to first production lot.
• Create a gated lot-release workflow with named approvers for first 4 production weeks.
• Channel Selection & Naming Convention
• Create a single source-of-truth communication channel for all production issues with clear ownership.
• Agree on triage rules and SLAs so responses are predictable and measurable.
• Establish an escalation path that protects delivery commitments while enabling rapid technical decisions.
• Define CI meeting cadence and how improvement items are tracked to closure.
• Opening and Objectives
• Create initial incident templates and assign primary on-call contacts for the first 90 days.
• Schedule recurring weekly ops sync and monthly quality review in calendars.
• Recap of Agreed Future State & Success Signals
• Objectively assess production performance against the agreed success signals and determine ramp health.
• Resolve whether to progress to next ramp volume or require corrective actions before scaling.
• Maintain a prioritized CI backlog with owners and timelines to drive measurable improvements.
• Ensure transparency and shared understanding between customer and assembler on ongoing risks and mitigations.
• Publish the KPI dashboard and CI backlog with owners and due dates after the meeting.
• If required, trigger formal remediation plan with checkpoints and a go/no-go review before expanding volume.
• Schedule the next 30/90-day performance checkpoint and invite cross-functional stakeholders.
• Reach a clear acceptance decision on the trial build against each pre-agreed success signal.
• Document gaps and agree on remediation actions and owners where signals are unmet.
• Ensure all attendees validate that evidence presented matches their interpretation of success signals.
• Set explicit deadlines for outstanding evidence or rework if acceptance is conditional.
• Publish the formal acceptance record (signed checklist) and attach inspection images and yield report.
• If conditional, create remediation plan with owners, acceptance retest criteria, and due dates.
• If accepted, schedule the production transition meeting and confirm target start date.
• One-sentence Future State
• Obtain formal go/no-go approval to begin scheduled production with commercial and operational SLAs signed off.
• Ensure parts availability and sourcing ownership are explicit to avoid downstream delays.
• Confirm quality gates and lot release criteria that will apply to production lots.
• Lock the initial weekly production schedule and identify first week owners.
• Issue signed commercial agreement and SLA attachments to all stakeholders.
• Create a parts availability dashboard and assign procurement owners for flagged components.
• Publish the production lot release checklist and assign QC owner for first 4 weeks.
• Handover Statement (Current vs Future)
• Ensure production engineers own the detailed process and can reproduce trial results consistently.
• Process Flow & Work Instructions Review
• Current State Recap (1-sentence)
• Commercial Terms & SLAs
• Triage Process & Severity Definitions
• KPI Dashboard Walkthrough
• IPC Class 3 Controls & Inspection Workflow
• Open Issues, Countermeasures & RCA Status
• Evidence Walkthrough vs Success Signals
• Escalation Matrix & Decision Authorities
• Sourcing & Parts Availability Confirmation
• Traceability, Lot Serialization & Documentation
• Consequence & Risk Summary
• CI Backlog Prioritization
• Quality & Acceptance Criteria for Production
• Continuous Improvement Cadence
• Training & Knowledge Transfer
• Decision & Next Milestones
• Capacity, Scheduling & Ramp Plan
• Reporting & RCA Expectations
• Validation & Clarifying Questions