Technology Semiconductor & Chip Design Automotive Chip Design

Automotive System-on-Chip Design

Long-cycle design programs where IP, foundry, and ecosystem partnerships execute against tapeout and market windows.

Example organizations in this space: Qualcomm NXP Semiconductors Renesas Texas Instruments

This interactive experience is the shipped product itself — the same application code customers run in production, mounted read-only in your browser over a real sample journey. Not a video, not a mockup: because the demo and the product are one codebase, it can never drift from the real thing.

Inside this journey
  1. Pre-Sales

    Qualify and diagnose before investing in a full evaluation cycle.

    1. Qualification

      Confirm budget range, decision-makers, timeline, and high-level fit before investing in detailed technical discovery.

      Qualification Questions

      High-level technical and compliance fit

      • To make the best use of your time, which functional-safety level must the platform support? Options: No functional-safety requirement, ASIL-B or lower, ASIL-C, ASIL-D, Higher than ASIL-D (above platform support)
      • Which of these technical constraints are must-haves for your program? Select all that apply. Options: Low real-time latency for safety-critical functions, High application processing throughput for multi-domain consolidation, Integrated vehicle network interfaces (CAN/CAN-FD, LIN, Ethernet), Low power / tight thermal envelope for sealed enclosures, Hardware security modules and secure boot, Mature software ecosystem (BSPs, AUTOSAR, hypervisor support)
      • Roughly which class of compute does your target architecture require per vehicle? Options: Entry-level control and body controller class, Mid-range cockpit / mixed-domain class, High-performance centralized domain or ADAS class, Uncertain / prefer to discuss
      • Does your program require automotive-grade qualification (AEC-Q100 Grade 1) or an alternate qualification? Options: AEC-Q100 Grade 1 required, Higher than Grade 1 (please specify in follow-up), No automotive-grade requirement, Unsure

      Budget

      • Is there an allocated budget range for the silicon platform in this program? Options: No budget assigned yet, Low (under $15 per unit), Medium ($15–$50 per unit), High ($50–$200 per unit), Very high (over $200 per unit), Prefer not to state

      Decision authority

      • Who will sign off on the silicon selection for this program? Options: VP of Engineering or Chief Architect (decision-maker), Program Manager (primary influencer/approver), Procurement lead, Cross-functional committee, Undecided / need to identify

      Timeline and next step

      • What is your target decision or commit milestone for selecting a silicon platform? Options: Within 1 month, 1–3 months, 3–6 months, 6–12 months, More than 12 months, Unsure
      • If there is a single program date driving this timeline (prototype, vehicle freeze, production launch), please name it or its target month.
    2. Technical Discovery

      Map current architecture, performance targets, safety constraints, stakeholder roles, and program timelines.

      Discovery Questions

      Start Line: Program goals, scope, and decision signals

      • Tell me the vehicle program class and the planned production start month and year.
      • How many ECU domains or consolidated zones are you planning this architecture to support? Options: 1-2, 3-4, 5-7, 8-10, More than 10
      • Provide your target production volumes in year one and year three.
      • Who on your team will be the decision owner for selecting the SoC family and who will own system integration?
      • Do you already have a target budget range for compute and module cost per vehicle? Options: Under $25, $25–75, $75–200, Over $200, Undecided
      • If the first silicon candidate meets peak performance but misses a safety timing target, would you continue qualification, pause for a revision, or re-scope the prototype plan? Options: Continue with mitigation plan, Pause until timing is fixed, Proceed for non-safety variants only, Re-scope the prototype plan

      Where your architecture today diverges from the roadmap

      • When you overlay your current architecture with your roadmap, where does capability fall short of your three-year target?
      • Walk me through your current compute stack for the zone or controller that will host both safety and non-safety workloads, include CPU classes, real-time cores, GPUs, and accelerators.
      • Select the vehicle networks and peripheral interfaces you use for this controller, choose all that apply. Options: CAN, CAN-FD, LIN, FlexRay, MOST, Ethernet (100BASE-T1), Ethernet TSN, PCIe, USB, Other
      • Estimate your current end-to-end latency budget for the most timing-critical function and the percent of that budget already consumed by software layers.
      • Identify the team or role that currently verifies hardware-software interaction and signs off on timing and safety budgets. Options: System integration team, Safety engineering, Software integration, Architecture team, Third-party lab
      • What single integration dependency in your current architecture, if unavailable, would force you to delay a prototype milestone?

      Hard targets: what would make or break a candidate

      • What single performance or safety metric would make you walk away from a candidate SoC immediately? Options: Misses ASIL-D timing for a safety function, Insufficient multi-core throughput, Thermal limits exceeded in sealed enclosure, Missing HW security or root of trust, Software ecosystem immaturity
      • Quantify your required sustained multi-core throughput for consolidation workloads in TOPS, DMIPS, or equivalent, and list which workloads consume the most compute.
      • Which functions must meet ISO 26262 ASIL-D timing and how are you planning to partition safety-critical tasks across real-time and application cores?
      • How much thermal headroom and package power budget do you reserve for peak scenarios in a sealed enclosure? Options: Less than 5 W, 5–10 W, 10–20 W, More than 20 W, Not defined
      • Estimate the maximum tolerable soft error or fail rate for safety subsystems over a 15-year program and list any silicon-level mitigations you require.
      • If the vendor cannot deliver required safety artifacts within your timeline, what is the shortest acceptable delay before the program is at material risk? Options: Less than 2 weeks, 2–4 weeks, 1–2 months, More than 2 months, Program at risk immediately

      Software ecosystem and driver reality check

      • Which middleware, hypervisor, and AUTOSAR RTE versions are you planning to use, and which gaps in those stacks would immediately block supplier qualification? Options: AUTOSAR Classic, AUTOSAR Adaptive, Commercial hypervisor required, Open-source hypervisor acceptable, Specific middleware versions required
      • Describe your preferred BSP and driver ownership model, do you expect the seller to deliver production-ready BSPs, or will your team own BSP maintenance? Options: Seller delivers production-ready BSP, Buyer owns BSP maintenance, Shared ownership with seller support, Third-party BSP vendor
      • How many legacy peripheral variants and software forks do you support across product lines that would need BSP or driver adaptation? Options: None, 1–3, 4–10, More than 10
      • List ownership for CAN, LIN, MOST, Ethernet TSN and other interface stacks in your current integration plan, and note whether APIs are available for the integration endpoint.
      • List the development toolchains, compilers, and CI environment types that must be supported out of the box to avoid rebuilds. Options: GCC toolchain, Clang, Commercial compiler, Vendor-specific toolchain, Jenkins/GitLab CI, Other
      • If a required peripheral driver is missing, what is the maximum delay in weeks your integration schedule can tolerate before qualification milestones slip? Options: Less than 2 weeks, 2–4 weeks, 1–2 months, More than 2 months, Program halts

      Where projects stall and what usually breaks first

      • Describe a recurring integration failure or supplier behavior that historically caused the longest program delays for you.
      • When a critical interface fails certification, who is enabled to re-scope the work and how long does that decision typically take? Options: Program manager, VP engineering, System architect, Safety lead, Cross-functional committee
      • Roughly, what's the size of the engineering team you allocate to SoC bring-up and integration in the first six months? Options: Less than 2 FTE, 2–5 FTE, 6–10 FTE, 11–20 FTE, More than 20 FTE
      • Provide the names of external vendors, test labs, or service providers you rely on for environmental, EMC, and ATE qualification, and flag any with long lead times.
      • If you had to name the single schedule risk that would stop the program from moving to pilot, what would it be?
      • How often do hardware supply issues drive changes to software schedules, in months between incidents? Options: Less than 1 month, 1–3 months, 3–6 months, 6–12 months, Rarely

      Competitive landscape, alternatives, and the case for staying put

      • Name the suppliers, incumbent options, and internal projects you are actively evaluating for SoC or internal options, and indicate which is the current frontrunner. Options: Incumbent supplier, Internal SoC project, New commercial silicon vendor, ODM platform, Software-only consolidation
      • Which alternatives on your short list are internal builds, incumbent suppliers, or third-party platforms, select all that apply. Options: Internal build, Incumbent supplier, New commercial vendor, ODM platform, Software-only alternative
      • Explain the conditions under which you would keep the incumbent or internal approach rather than switching to a new supplier.
      • Has anyone internally proposed solving this with in-house silicon or a software-only approach, and if so who owns that proposal? Options: Yes, architecture team, Yes, IC design team, Yes, software team, No, Undecided
      • If a supplier demonstrated parity on performance but required longer support and supply commitments, would that change your preference? Options: Yes, prefer that supplier, No, prefer incumbent, Depends on cost and warranty, Unsure
      • Which single business decision, if made this month, would accelerate a signature within 30 days?

      Operational readiness and implementation constraints

      • If you cannot commit lab access and test harnesses in the first 12 weeks, how will you meet the qualification timeline? Options: We can commit full lab access immediately, Partial access with conditions, Access after approvals in 2–4 weeks, No lab access within 12 weeks
      • Identify the owner of APIs and firmware updates for any third-party modules that must be integrated, and state when they can grant access. Options: Integration team, Supplier/vendor, Third-party module vendor, Hardware vendor, Undecided
      • To proceed, the seller requires a primary point of contact with network access and appropriate approvals, can you provide that contact within two weeks? Options: Yes, available now, Yes, within 2 weeks, 3–6 weeks, No, cannot provide
      • Do you have internal headcount experienced in ISO 26262 activities and AEC-Q100 acceptance testing, or will you rely on external consultants? Options: Yes, qualified in-house, Yes, but limited capacity, No, will use external consultants, Undecided
      • Which software artifacts and test data are available now for the seller to run initial validation, select all that apply. Options: BSP source, Device drivers, Regression test suites, Sample datasets, Safety case artifacts, None available
      • If critical infrastructure is missing, what is the earliest date you could make it available without changing your project milestones? Options: Within 2 weeks, Within 4 weeks, Within 8 weeks, Longer than 8 weeks, Cannot commit

      Decisive acceptance criteria and next steps

      • If an initial prototype meets the key acceptance criteria, which internal approvals would immediately clear you to enter a supply agreement, select all that apply. Options: Program approval, Procurement sign-off, Safety sign-off, Executive commercial approval, Legal approval
      • Provide your top three measurable acceptance criteria you require for qualification sign-off and include target numbers or pass thresholds.
      • Who must sign the qualification gate within your organization and what is their approval timeline once results are available?
      • If the pilot proves the metrics, what is the single remaining barrier that would prevent you from signing within 30 days?
      • When would you prefer the seller to schedule a joint technical review, within the next 2 weeks, 4 weeks, 8 weeks, or later? Options: Within 2 weeks, Within 4 weeks, Within 8 weeks, Later than 8 weeks
      • Would a trial hardware loan and a two-week lab support window accelerate your evaluation and move you closer to decision? Options: Yes, would accelerate and lead to commitment, Yes, would accelerate but need more data, No, not sufficient, Maybe
  2. Hardware Evaluation

    Hands-on validation against the buyer's acceptance criteria for compute, latency, peripheral integration, power, and software ecosystem maturity.

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  3. Solution Scope

    Define the SoC family options, responsibilities, verification milestones, and measurable acceptance criteria for qualification and production.

    Scope Configuration

    • Supply automotive-qualified SoC devices
    • Deliver reference carrier board and EVK kit
    • Provide Linux board support package (BSP)
    • Provide AUTOSAR MCAL driver package
    • Provide hypervisor BSP and reference partitioning
    • Deliver safety‑ready RT-core firmware and safety libraries (ASIL‑D support)
    • Deliver hardware security module and key provisioning tools
    • Deliver vehicle network interface drivers (CAN/CAN‑FD/LIN/FlexRay/TSN)
    • Deliver GPU and NPU driver stack with runtimes
    • Deliver bootloader and secure boot implementation
    • Provide power management firmware and DVFS profiles
    • Deliver long‑term production supply and change‑notification agreement

    Scope Questions

    Supply automotive-qualified SoC devices

    • For your program, which SoC family options should be evaluated (entry-level body controller, mid-range domain controller, high-performance cockpit/ADAS)? Options: Entry-level (low-power), Mid-range (balanced), High-performance (multi-domain consolidation), Multiple classes — specify in free text
    • How many application CPU cores and how many real-time cores must available SoC variants include to meet your consolidation goals? Options: 1-4 application cores / 0-2 real-time cores, 4-8 application cores / 1-4 real-time cores, 8+ application cores / 2+ real-time cores, Specify exact counts
    • Specify the AEC-Q100 grade and ambient temperature range your qualification requires for production devices. Options: AEC-Q100 Grade 1 (–40°C to 125°C), AEC-Q100 Grade 2 (less common), Custom / specify
    • Describe the sustained multi-core throughput or inference targets you require (examples: TOPS for NPU, sustained CPU throughput targets, or benchmark names and target numbers).
    • Identify the peripheral interface counts and types you require on the die (example: CAN FD controllers, TSN ports, PCIe lanes, MIPI-CSI/DSI lanes). Options: CAN FD channels, TSN Ethernet ports, PCIe lanes, MIPI-CSI / MIPI-DSI, Other
    • Which acceptance evidence will confirm the devices meet automotive qualification for your program (examples: AEC-Q100 certificate, temperature cycle report, ISO 26262 safety assessment)? Options: AEC-Q100 certificate and datasheet, Temperature cycle and HAST reports, Electrical characterization report (IV/IDDT), ISO 26262 safety assessment artifacts, Other — specify

    Deliver reference carrier board and EVK kit

    • Which EVK interfaces must be present on the carrier board to support your integration (examples: PCIe, multiple CAN FD transceivers, USB, M.2, TSN Ethernet)? Options: PCIe x4, PCIe x1, Multiple CAN FD transceivers, M.2 slot, USB 3.x, TSN-capable Ethernet, Other
    • How many populated peripheral connectors and how many thermal mounting points do you require on the EVK for your lab validation and harnessing? Options: 1-2 connectors / 1 thermal mount, 3-4 connectors / 2 thermal mounts, 5+ connectors / custom thermal solution, Specify exact counts
    • Specify the board-level power rails and maximum board power draw allowance the EVK must support for your peak and idle test profiles (in watts and voltage rails).
    • Describe mechanical form factor or mezzanine footprint constraints the EVK must match for your integration (examples: SOM pinout compatibility, custom mezzanine dimensions).
    • Which electrical and environmental test results will you accept for the EVK as evidence of readiness (examples: thermal soak data, EMI/EMC pre-compliance, measured power draw thresholds)? Options: Thermal soak and thermal imaging data, EMI/EMC pre-compliance report, Power envelope validation over workload, Mechanical vibration report, Other — specify
    • Do you require factory-flashed sample firmware, labeled kit contents, and serial-number traceability for EVK sample deliveries? Options: Yes, No

    Provide Linux board support package (BSP)

    • Which Linux kernel major baseline (example: LTS 5.x, LTS 6.x) and patch set do you plan to use as the BSP upstream for your integration? Options: LTS 5.x, LTS 6.x, Custom kernel baseline — specify, Unsure / need recommendation
    • Which device tree overlays and middleware components must the BSP include for your vehicle platform (examples: display stack, CAN FD support, TSN config, GPU/NPU bindings)? Options: Display stack and DRM bindings, CAN FD controller and ISO-TP, TSN configuration, GPU/NPU bindings, Other — specify
    • Do you require PREEMPT_RT or other real-time kernel patches applied and maintained in the BSP for your deterministic workloads? Options: Yes — PREEMPT_RT required, No — standard kernel acceptable, Undecided — need guidance
    • Specify your cold start and boot-to-application time target for cockpit or instrument cluster use cases (time from power applied to first-frame or UI ready, in seconds).
    • Identify the BSP delivery artifacts you need with the package (examples: kernel config, cross-toolchain, reproducible build scripts, kernel crash collection tooling). Options: Kernel .config, Cross-toolchain and toolchain versions, Reproducible build scripts, Kernel crash collection and analysis tools, Other — specify
    • Do you require BSP security hardening guidance and secure-boot integration documentation as part of the BSP handoff? Options: Yes, No

    Provide AUTOSAR MCAL driver package

    • Which AUTOSAR stack type and MCAL baseline do you require (Classic Platform, Adaptive, or both) for your ECU integration? Options: Classic Platform, Adaptive Platform, Both Classic and Adaptive, Specify version/release
    • Specify the number and types of vehicle network controller channels the MCAL drivers must cover (examples: CAN FD controller count, LIN channels, FlexRay controllers, Ethernet ports).
    • Describe timing constraints for MCAL driver responses that are critical to your ECU behavior (examples: ISR latency budget in microseconds, polling intervals).
    • Do you need MCAL delivered with ARXML-compatible configuration exports that plug into your ECU configurator toolchain? Options: Yes — ARXML exports required, No — alternative format acceptable, Need guidance
    • Identify the MCAL configuration and test artifacts you will supply or require during integration (examples: generated ARXML, unit test logs, timing profiles).
    • Are there legacy API compatibility requirements or specific function prototypes the MCAL must expose for reuse of your existing ECU software? Options: Yes — list required APIs, No — new APIs acceptable

    Provide hypervisor BSP and reference partitioning

    • Which guest OS types and partitioning model should the hypervisor reference support (examples: Linux user domain, AUTOSAR Classic, RTOS for safety cores)? Options: Linux user domain, AUTOSAR Classic domain, RTOS safety domain, Mixed-criticality — combination of above
    • Specify the isolation boundaries and guaranteed performance you require for partitions (examples: CPU slices, memory carve-outs, worst-case latency budgets in microseconds).
    • Do you require pre-built reference partition images and example VM layouts to use in your ISO 26262 demonstration and safety audits? Options: Yes, No
    • Provide the expected boot and warm-reboot sequencing behavior for the hypervisor and partitions that your integration will rely on.
    • Are you planning to run mixed-criticality workloads with ASIL-D domains alongside non-safety domains; if so, list the ASIL assignments per partition or domain.
    • Which hypervisor configuration artifacts will you need delivered (examples: partition descriptors, resource tables, scheduling policy files)?

    Deliver safety‑ready RT-core firmware and safety libraries (ASIL‑D support)

    • List the RT-core firmware modules and safety libraries you need for your control functions (examples: watchdog, lockstep support, safe-IO drivers).
    • Which ISO 26262 ASIL levels and specific safety goals must the delivered firmware and libraries support for your program? Options: ASIL-A, ASIL-B, ASIL-C, ASIL-D, Mixed ASIL — specify mapping
    • Identify the safety artifact file formats and documents you must consume during integration (examples: FMEDA spreadsheets, fault injection reports, software architectural design descriptions). Options: FMEDA (spreadsheet), Fault injection reports, Software architecture document (SAD), Safety manual and user guidance, Other — specify
    • Do you require cross-validation test benches, golden reference traces, or hardware-in-the-loop fixtures for RT-core deterministic behavior verification? Options: Yes — test benches required, No — not required
    • Specify the maximum allowed interrupt latency and recovery time for safety-critical RT-core firmware in microseconds that your safety case depends on.
    • Which toolchain and compiler versions must be used to build safety libraries to align with your tool qualification plan?

    Deliver hardware security module and key provisioning tools

    • Which root-of-trust functions and cryptographic algorithms do you require from the hardware security module (examples: secure key storage, ECDSA, AES-GCM, hardware RNG)? Options: Secure key storage, ECDSA, RSA, AES-GCM, Hardware RNG, Other — specify
    • Specify the provisioning workflow you will adopt for device keys (examples: factory secure provisioning, on-site secure provisioning, offline provisioning with HSM appliance). Options: Factory provisioning, On-site secure provisioning, Offline/air-gapped provisioning, Need recommendation
    • Describe required attestation and secure-boot integration artifacts you expect from HSM delivery (examples: signed manifests, attestation certificates, audit logs).
    • Do you require FIPS or Common Criteria certification levels for the hardware security module for your program? Options: Yes — specify level, No
    • Identify key lifecycle management constraints you will enforce (examples: key rotation frequency, rollback prevention requirements, secure erase policy).
    • Which developer tools, CLIs, or APIs do you need for automated key provisioning and integration into your factory test flow?

    Deliver vehicle network interface drivers (CAN/CAN‑FD/LIN/FlexRay/TSN)

    • Which vehicle bus types and channel counts must the driver package cover for your platform (examples: number of CAN FD channels, number of TSN ports)? Options: CAN FD channels, LIN channels, FlexRay controllers, TSN Ethernet ports, Other — specify
    • Specify required bus speeds and timing parameters for each interface you will use (examples: CAN FD bitrates, TSN scheduling windows).
    • Describe the diagnostics, logging, and DLT integration points you require from the network drivers for POC and field diagnostics.
    • Do you require built-in support for ISO-TP or UDS over CAN in the delivered driver stack? Options: Yes — ISO-TP and UDS required, No — not required, Partial — only ISO-TP or only UDS
    • List the test vector types you will run during network driver integration (examples: bus load, error injection, wake/sleep cycles). Options: Bus load/stress, Error injection, Wake/sleep cycle tests, Bit error/latency profiling, Other — specify
    • Are there specific transceiver variants or PHY vendor families your carrier board must be compatible with? Options: Yes — specify part families, No — any compatible transceiver ok

    Deliver GPU and NPU driver stack with runtimes

    • Which graphics and neural runtimes must be supported out of the box for your application (examples: Vulkan or OpenGL ES for graphics, and which NN runtime versions for NPU)? Options: OpenGL ES, Vulkan, NN runtime v1, NN runtime v2, Other — specify
    • Specify the inference performance target (TOPS) and target frames-per-second for display workloads that the driver stack must sustain for your use case.
    • Describe any deterministic rendering or preemption guarantees you need for mixed-criticality displays (examples: guaranteed frame latency under X ms).
    • Do you require validated GPU/NPU power vs. performance curves and thermal throttling profiles to be delivered with the driver stack? Options: Yes — required, No — not required
    • Provide the profiling artifacts you expect with driver delivery (examples: trace logs, power vs. performance charts, benchmark scripts).
    • Which user-space ABI stability commitments or long-term driver compatibility guarantees do you require for your program?

    Deliver bootloader and secure boot implementation

    • Specify the secure boot chain, signing algorithm families, and key storage expectations you require for production devices.
    • Which bootloader features are mandatory for your OTA and field update strategy (examples: A/B update, rollback protection, signed update verification)? Options: A/B updates, Rollback protection, Signed OTA verification, Emergency recovery mode, Other — specify
    • Describe the recovery and emergency flash programming process you require for field units and service bay procedures.
    • Do you require a verified boot sequence and audit logs for each boot to support forensic analysis and field failure investigation? Options: Yes, No
    • Identify the test vectors and boot logs you plan to review during bootloader validation (examples: chain-of-trust verification logs, rollback test traces).
    • Are there secure element or TPM interfaces the bootloader must integrate with on your production hardware? Options: Yes — specify interface/part family, No
  4. Mutual Commit

    Finalize commercial and legal terms, long‑term supply commitments, qualification milestones, and mutual obligations.

    Agreement Modules

    • Long-Term Supply Agreement
    • Purchase Agreement / Order Confirmation
    • Qualification & Acceptance Plan
    • Quality, Safety and Compliance Addendum
    • Software License Agreement
    • Warranty, Returns and Field Support Agreement
    • Change Control and Engineering Change Notice (ECN) Process
    • Confidentiality and IP Protection Agreement
    • Source Code Escrow Agreement (conditional)
    • Commercial Terms Summary & Payment Schedule
  5. Deployment

    Operationalize validation, production ramp, and release with readiness checks and acceptance gates.

    1. Pre-Deployment Readiness

      Confirm lab access, validation owners, test harnesses, sample schedules, and environment readiness required for integration and qualification runs.

      Pre-Deployment Questions

      Environment and site access

      • Will integration and qualification runs occur at a single lab site or multiple sites? (so we can assign site-specific logistics) Options: Single site, Multiple sites
      • For each site to be used, provide the site name and primary lab contact (name, role, email) — this lets us open access requests and coordinate deliveries
      • Is physical lab access for the seller's validation engineers granted at each site? Options: Yes — full technical access granted, Yes — limited/escorted access only, Pending — approvals required, No — remote-only access planned

      Test harnesses and samples

      • Which validation harness types will be used during integration? (select all that apply) Options: Hardware‑in‑the‑loop (HIL) bench, Device-under-test (DUT) functional bench, Software simulation/emulation, Supplier‑provided fixtures, Automated test cell with robotics
      • Are the buyer's acceptance criteria and canonical test cases available to the seller for pre‑run verification? Options: Yes — full test kit available to seller, Yes — partial (gaps noted), No — awaiting delivery, No — access restricted (requires request)
      • Has a sample delivery schedule been agreed (initial eval, qualification, production samples)? If yes, list milestone names and dates so we can plan test windows.

      People and ownership

      • Who are the named owners for Validation lead, Integration lead, and Functional‑safety lead? Provide name, role, and primary contact so we can assign task ownership.
      • Do the named owners have sign‑off authority for qualification test runs and sample acceptance? Options: Yes — single approver per area, Yes — delegated team approvers, No — cross‑stakeholder sign‑off required, Pending — authority to be assigned
      • Who is responsible for lab network and cybersecurity during validation runs (buyer, seller, or third‑party lab)? Provide organization and contact to coordinate remote access setup.

      Timing and constraints

      • Are there blackout windows, production freezes, or compliance gates that restrict when integration/qualification runs can occur? Options: No known constraints, Known blackout windows (dates to follow), Regulatory/compliance gate required before runs, Other (please specify)
      • Is the site infrastructure validated to support DUT environmental needs (power, cooling, and specified ambient/environment profile)? Options: Yes — infrastructure meets required profile, Partially — some specs pending validation, No — upgrades required before runs
      • Will remote debug/telemetry be available to seller engineers during runs (VPN/remote console), or will debugging be on‑site only? Note restriction type so we can plan remote procedures. Options: Remote access enabled, On‑site only, Restricted remote access (IP/port whitelisting), Not enabled — setup required
    2. Integration Configuration

      Capture exact integration and configuration values the teams will use — interface mappings, firmware settings, BSP/hypervisor versions, and toolchain requirements.

      Configuration Details

      Integration environment & endpoints

      • Primary integration environment name (single token; Default: lab-integration)
      • Primary Linux BSP kernel version to deploy on integration boards (format: major.minor.patch — Default: 5.10.0)
      • Primary hypervisor variant to use for integration (Default: Type-1 automotive hypervisor) Options: None (native Linux), Type-1 automotive hypervisor (paravirtualized guests) (Default), RTOS-based partitioning hypervisor, Containerized Linux-only separation

      Interface & peripheral mappings (one mapping per question)

      • Primary Ethernet interface mapping (format: SoC_interface->vehicle_domain_interface, e.g., GMAC1->domain_eth; Default mapping: eth0->domain_eth)
      • Primary CAN/CAN-FD port mapping (format: SoC_port->vehicle_net_name, e.g., CAN1->powertrain_CAN)
      • UART console port and baud rate for integration (format: UARTx,baud — Default: UART0,115200)

      Firmware, bootloader, and toolchain

      • Bootloader version or tag to install on integration boards (format: tag or semver — Default: v2023.04)
      • Real-time MCU firmware image version for safety cores (format: major.minor.build — Default: 1.0.0)
      • Cross-toolchain selection to build kernel and BSP images (Default: GCC 11.3) Options: GCC 9.4, GCC 11.3 (Default), GCC 12.2, Clang 14, Other
      • If you selected 'Other' for cross-toolchain, enter the exact toolchain identifier (e.g., customtoolchain-2024-07). Leave blank if not applicable.

      Hypervisor partitioning, safety, and artifact handoff

      • Hypervisor partitioning config filename or repo tag to load on integration (format: filename or repo:tag — Default: partition-config.yaml)
      • CPU affinity mask for safety partitions (format: hex bitmask, e.g., 0x3 for cores 0-1 — Default: 0x3)
      • Target functional-safety level for this integration (Default: ASIL-D) Options: QM/No ASIL, ASIL-A, ASIL-B, ASIL-C, ASIL-D (Default)
      • Primary artifact repository URL for BSPs, boot images, and firmware (format: https://... — Default: https://artifacts.example.com/integration)
      • Artifact repository credential identifier (service account name or key name stored in your secrets manager). Do NOT paste secrets here; provide the non-secret identifier only.
      • Secrets manager or secure handoff method where the artifact secret will be exchanged (choose one — Default: your secrets manager) Options: your secrets manager (on-prem or cloud) (Default), Secure SFTP handoff, On-site/manual handover
    3. Validation & Production Ramp

      Execute engineering validation, ISO/functional-safety activities, qualification testing, and scaled production ramp with clear owners and timelines.

    4. Production Release Acceptance

      Formal acceptance gate: verify qualification results, safety sign-offs, AEC compliance, and production sample approvals before full supply release.

      Checklist items

      • Receive signed final qualification test report
      • Obtain functional safety sign-off
      • Receive automotive qualification certificate and reliability summary
      • Approve environmental and stress-test reports
      • Obtain production sample approval
      • Approve First Article Inspection (FAI) and process control plan
      • Finalize packaging, labeling, and traceability
      • Close or document engineering changes impacting release
      • Approve failure analysis and field returns procedures
      • Issue formal production release authorization
  6. Success

    Monitor outcomes, capture learnings from qualification and ramp, and maintain a shared channel for issues and enhancement requests.

    Success Reviews

    • Go-live Health Check (weeks 1-4)
    • First Measurement Review (weeks 4-10)
    • Acceptance Gate, Qualification Decision (around day 90)
    • Production Ramp Review (month 3-6 post-acceptance)
    • Quarterly Success Review (operational cadence)

    Issues & Enhancements

    • Launch supplier corrective action requests where supplier-related defects affect yield.
    • Any failed criteria have a mitigation and verification plan with target completion dates.
    • Acceptance records and evidence are archived for traceability to qualification artifacts.
    • Publish the formal acceptance decision document that lists pass/fail per criterion and includes the signatory record.
    • For failed items, publish a remediation and verification plan with concrete run windows and target dates.
    • Update the project tracker to reflect the move to production ramp monitoring and set the next review date.
    • Present production sample yield and test coverage
    • Production yield and field failure metrics are shown vs targets from Solution Scope and either meet targets or have agreed remediation.
    • Containment plans for any quality or supplier issues are defined with resolution dates.
    • Schedule for subsequent verification runs and the next ramp review is confirmed.
    • Issue a production-ramp status report that includes yield, PPM, and test coverage against Solution Scope targets.
    • Reconfirm success criteria and owners
    • Schedule extended thermal soak runs and publish results to the shared validation channel.
    • Trend review of primary metrics
    • Primary operational metrics remain within the range expected by the Solution Scope or have agreed corrective actions.
    • Enhancement request backlog is reviewed and has a prioritized plan for the coming quarter.
    • Shared issue channel and runbook are confirmed current and accessible to both teams.
    • Publish the quarterly metric dashboard with trend lines for the cited metrics and link to the evidence.
    • Close enhancement requests documented as obsolete and re-assign those requiring active work to the backlog with dates.
    • Update the runbook and shared issue channel with the latest escalation contacts and verification steps.
    • Deployment baseline is confirmed and all required lab and sample access is validated.
    • Top open blockers are documented with remediation actions and target dates.
    • Owners for each acceptance criterion recorded in the Solution Scope are confirmed.
    • Publish a deployment baseline checklist confirming sample IDs, lab access credentials, and test harness versions.
    • Document the top 5 open defects with temporary mitigations and target remediation dates.
    • Circulate the agreed short-term remediation plan and schedule the first-measurement data collection window.
    • Present measured results vs Solution Scope targets
    • Measured values for the named metrics are recorded and compared to targets in Solution Scope.
    • Root-cause actions are agreed for any metric outside target and have clear verification steps.
    • Schedule for final acceptance gate is confirmed with the data set and owners defined.
    • Publish the first-measurement report with raw logs and aggregated metrics referenced to the Solution Scope targets.
    • Initiate the agreed remediation test runs and record the verification protocol and completion dates.
    • Prepare the acceptance gate packet that lists each acceptance criterion and the supporting evidence to be presented.
    • Restate acceptance criteria and pass/fail matrix
    • Each acceptance criterion from Solution Scope is recorded as pass or fail with a documented signatory.
    • Analyze field failure and warranty data
    • Present outcome data against each criterion
    • Diagnose root causes for any gaps
    • Deployment and sample availability validation
    • Persistent issues and blocker status
    • Early integration and onboarding signals
    • Enhancement request backlog review
    • Document pass or fail per criterion and capture signatory
    • Thermal and power stability verification
    • Agree corrective actions and verification plan
    • Confirm timeline to the acceptance gate
    • Operational runbook and shared channel health
    • Supply, quality, and supplier issue triage
    • Agree remediation plan for any failed criteria
    • Open defects and blocker triage
    • Agree next quarter actions or shorten meeting if no changes
    • Agree immediate remediation actions and timeline
    • Close acceptance meeting and confirm next operational cadence
    • Agree corrective actions and ramp-to-volume milestones
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