Technology Semiconductor & Chip Design Automotive Chip Design

In-Vehicle Networks

Long-cycle design programs where IP, foundry, and ecosystem partnerships execute against tapeout and market windows.

Example organizations in this space: NXP Semiconductors Bosch Renesas STMicroelectronics

This interactive experience is the shipped product itself — the same application code customers run in production, mounted read-only in your browser over a real sample journey. Not a video, not a mockup: because the demo and the product are one codebase, it can never drift from the real thing.

Inside this journey
  1. Technical Discovery

    Align on performance priorities (data rate, latency, EMC, sleep power), timeline constraints, stakeholders, and success signals for silicon selection and network architecture.

    Discovery Questions

    Opening the Technical Conversation

    • Tell me briefly which vehicle platform program is driving your move to a zonal Ethernet backbone and the platform freeze date you are working toward
    • How many ECUs or separate domains do you expect to migrate to the zonal backbone in your first production wave Options: 1-10, 11-50, 51-200, 200+
    • What are your top three measurable priorities from this list, rank them if possible Options: Data rate, Deterministic latency, EMC margin, Sleep-mode power, AUTOSAR compliance, OPEN Alliance compliance, Diagnostic visibility
    • Describe the people and roles that must sign off on silicon selection and network architecture at your organization

    Where the current network falls short

    • Which single risk in your current approach would make you stop the program immediately if it could not be mitigated Options: EMC failure, Latency out of spec, Sleep power too high, Protocol incompatibility, Supply continuity, Other
    • When interoperability problems have occurred on past projects, what happened and what was the downstream impact on schedule, cost, or warranty
    • Who on your team typically detects protocol or EMC incompatibility first, and what is the escalation path from discovery to resolution Options: Hardware validation lead, System architect, Software integration lead, EMC lab contact, Tier 1 integration team, Other
    • How do you currently validate EMC on early evaluation boards and how often have boards required rework because of EMC issues Options: Pre-compliance lab, Full automotive EMC lab, Supplier reports only, In-vehicle testing only, No formal EMC tests yet

    Performance priorities and trade-offs

    • If you had to sacrifice one performance attribute to meet timeline or power constraints, which would you accept and why Options: Data rate, Latency, EMC margin, Sleep-mode power, Diagnostics detail, Other
    • In your benchmarking so far, what latency and jitter targets have proven hardest to hit and on which topologies or evaluation-board scenarios
    • Which evaluation-board test cases cause the most integration rework in your experience Options: EMC radiated immunity, EMC conducted emissions, Sleep-mode power under wake scenarios, Gateway bridging message bursts, AUTOSAR/OPEN Alliance compliance tests, Other
    • Could failing to meet sleep-mode power targets force feature cuts or block OEM approval for the vehicle program Options: Yes, approval would be blocked, Yes, would force feature cuts, Would require additional mitigation but not block, No major impact, Unsure

    Timeline pressure and decision gates

    • Why is your platform freeze date nonnegotiable and what happens to the program if silicon is not qualified before that date
    • On average, how long have silicon qualification cycles and board-level errata mitigation taken on your last two platform programs Options: <3 months, 3-6 months, 6-12 months, 12-18 months, >18 months
    • Would you accept an accelerated qualification that reduces test scope to meet the freeze date if we agreed a remediation plan for the remaining tests Options: Yes, for critical tests only, Yes, with contingency and escrow, No, full qualification required, Unsure
    • When was the last time a part shortage or long lead caused you to change a chosen silicon, and what did that cost in time or design rework

    Integration readiness and resource constraints

    • What single dependency or internal capability, if missing, would prevent you from completing an evaluation board integration within 12 weeks Options: Access to vehicle network topology, Diagnostic firmware access, Dedicated lab bench time, Qualified connectors and cables, No missing dependencies, Other
    • Who currently owns the test environments and access to vehicle-level CAN, CAN FD, LIN, and Ethernet domains required to reproduce your topology Options: Your hardware lab, OEM central lab, Tier 1 partner lab, Third-party lab, No clear owner yet
    • Are the APIs, diagnostic logs, and firmware access we need already available to outside evaluation teams, or will restricted access slow work Options: Fully available, Available with NDA, Limited access, Not available
    • Estimate the number and specialties of engineers your team can commit to hands-on hardware integration and debugging during the evaluation

    What other options you are weighing

    • Name the incumbent supplier, internal program, or fallback option you would revert to if there were unresolved silicon issues, and explain why that option would win
    • Please list the alternatives you are actively evaluating, such as incumbent multi-protocol families, single-protocol vendors, startups focused on Ethernet, or internal gateway development Options: Incumbent multi-protocol vendor, Single-protocol families, Startups focused on Ethernet, Internal gateway development, Delay migration, Other
    • If your current approach could meet acceptance criteria with minor board changes, would you prefer that over qualifying a new silicon family Options: Yes, minimize change and risk, No, prefer future-proof solution, Depends on cost and timeline, Unsure
    • Identify who internally is advocating for an in-house software or gateway solution instead of qualifying new hardware Options: Systems architecture, Software platform team, Electronics platform group, Procurement, Other

    Defining evaluation scope and success signals

    • Specifically, which acceptance criteria would cause your team to sign off on a silicon for production and which of those are nonnegotiable
    • Provide the numeric measurement thresholds you require for EMC, deterministic latency, and sleep-mode power on evaluation boards where available
    • Walk me through the roles that will perform acceptance testing, who owns each qualification milestone, and who signs each milestone
    • Would you accept a split validation approach where some tests run in lab and others run in a timeboxed in-vehicle pilot Options: Yes, split validation, No, full vehicle validation required, Partial split with OEM approval, Unsure
    • Describe the handover artifacts and documentation you require at the end of evaluation to proceed to system integration

    Decision triggers and next steps

    • Assuming the evaluation demonstrates the required metrics, what internal approvals, budget signoffs, and procurement steps remain before you could commit to long-term supply
    • Within what timeline would you expect to finalize commercial terms and part qualification milestones after prototype validation Options: Immediately (within 2 weeks), Within 1 month, 1-3 months, 3-6 months, Longer than 6 months
    • Identify the operational or commercial risks that would make you delay production sign-off even if technical tests pass Options: Supply continuity, Unresolved errata, OEM spec changes, Certification delays, Cost increases, Other
    • Rate your procurement organization's confidence that decade-long supply commitments can be enforced with current supplier contracts, from 1 low to 5 high Options: 1, 2, 3, 4, 5
    • Could you run a time-boxed pilot build under an agreed errata handling protocol to accelerate commercial commitment Options: Yes, with defined scope, Yes, with warranty protections, No, not acceptable, Unsure
  2. Solution Experience

    Translate the buyer's network architecture goals into verification scenarios and integration paths using evaluation-board workflows and gateway bridging cases.

    Solution Experience

    • Solution Experience Session — Verification & Gateway Bridging
    • Confirm the current state and its cost
    • You confirm the proposed evaluation-board workflows cover the latency, EMC, and sleep-power scenarios you need for silicon selection.
    • Deliver a draft evaluation-board test matrix and gateway bridging test plan within 7 business days.
    • You confirm the gateway bridging test reproduces your interoperability risk and the proposed mitigation is acceptable.
    • Map your architecture goals to verification scenarios
    • Provide the current vehicle network topology, critical timing constraints, and the platform freeze date.
    • Provide any existing EMC, latency, or sleep-mode acceptance thresholds you must meet, and any AUTOSAR or OPEN Alliance conformance notes.
    • You agree on the remaining qualification evidence and which artifacts are required to meet the platform freeze decision points.
    • Walk one evaluation-board workflow end to end
    • Schedule the hands-on hardware evaluation session on mutually available dates within the next 10 business days.
    • You validate the timeline impact and accept the next-step delivery dates for hands-on evaluation.
    • Demonstrate a gateway bridging interoperability case
    • Align acceptance criteria and responsibilities
    • Identify the internal stakeholders who must sign off on qualification artifacts and their decision gate dates.
    • Validate that this matches your imperative
    • Solution Experience Session — Verification & Gateway Bridging
    • Solution Experience Deck
    • Solution Brief - Verification & Integration Plan
    • meeting
    • slides
    • document
  3. Evaluation Scope

    Define evaluation board test cases, acceptance criteria (EMC, latency, sleep-mode power, AUTOSAR/OPEN Alliance compliance), responsibilities, and qualification deliverables.

    Scope Configuration

    • Deliver multi-protocol transceiver ICs
    • Deliver automotive Ethernet PHYs
    • Deliver automotive Ethernet switch ICs
    • Deliver gateway processor ICs (CAN-to-Ethernet)
    • Ship evaluation board with reference firmware
    • Deliver AUTOSAR-compliant driver and diagnostic stack
    • Deliver unified diagnostic interface firmware package
    • Deliver AEC‑Q100 production parts and qualification kit
    • Provide ISO 26262 safety documentation package
    • Deliver silicon errata and board-level workaround kit
    • Deliver EMC-hardened reference PCB layout and filter kit
    • Deliver sleep-mode power profiles and firmware tuning
    • Ship production-qualification sample lots
    • Provide long-term production supply and allocation agreement

    Scope Questions

    Deliver multi-protocol transceiver ICs

    • Which protocols and maximum bitrates must the transceiver ICs support on your evaluation board (for example CAN FD 8 Mbit/s, Classical CAN 1 Mbit/s, LIN 20 kbit/s)? Options: Classical CAN 1 Mbit/s, CAN FD up to 8 Mbit/s, LIN 20 kbit/s, Single-wire CAN, Other
    • Identify the required isolation and voltage domains for the transceiver in your ECU reference design (for example 12 V battery domain, 24 V commercial vehicle domain, or galvanic isolation needed). Options: 12 V domain, 24 V domain, Galvanic isolation required, No isolation required, Other
    • State the target electromagnetic compatibility standard and test level you will validate the transceiver against on the evaluation board (for example CISPR 25 Class 5, ISO 11452-2). Options: CISPR 25 Class 5, CISPR 25 Class 3, ISO 11452-2, Custom/test-lab spec
    • Provide the acceptable sleep-mode current threshold for the transceiver measured on the evaluation board (specify in microamperes, uA).
    • Who will own pin-mapping and BOM decisions for the transceiver on your evaluation-board schematic? Options: Your hardware team, Joint working group, We will assign later

    Deliver automotive Ethernet PHYs

    • Select the PHY speeds you require on the evaluation board (for example 100BASE-T1, 1000BASE-T1, 10BASE-T1S). Options: 100BASE-T1, 1000BASE-T1, 10BASE-T1S, Other
    • Indicate the required physical-layer interface components for the PHY on the reference PCB (for example MDI magnetics, specific common-mode choke values, connector style). Options: MDI magnetics, Common-mode choke specified, Direct MDI (no magnetics), Other
    • List OPEN Alliance conformance test profiles or specific test cases the PHY must pass during your evaluation (cite the test profile or clause).
    • Provide the maximum allowed PHY-induced latency per hop in microseconds for your zonal Ethernet architecture. Options: < 10 µs, 10-50 µs, 50-200 µs, Custom
    • Specify any required PHY features for in-vehicle serviceability (for example MDIO management, power-down modes, wake-on-LINK). Options: MDIO required, Power-down modes required, Wake-on-LINK required, No special features

    Deliver automotive Ethernet switch ICs

    • Define the required port count and port types on the switch IC for your gateway prototype (for example 1x 1000BASE-T1 uplink, 4x 100BASE-T1 downstream). Options: 1x 1000BASE-T1 + 4x 100BASE-T1, 4x 100BASE-T1 only, 2x SGMII + PHY ports, Custom
    • Describe the required quality-of-service and cut-through latency thresholds per port for in-vehicle control messages (provide target in microseconds).
    • List the IEEE and TSN features the switch must support during your verification (for example IEEE 802.1Q, 802.1AS, 802.1Qbv). Options: 802.1Q VLAN, 802.1AS time sync, 802.1Qbv time-aware shaping, 802.1CB frame replication
    • Assign who will define switch ACLs, MAC provisioning, and priority mappings during evaluation. Options: Your network team, Shared working group, We will assign later
    • Estimate the forwarding table size and multicast group count the switch must sustain during gateway interoperability tests. Options: < 1k entries, 1k-10k entries, > 10k entries, Custom

    Deliver gateway processor ICs (CAN-to-Ethernet)

    • List the gateway use cases you will validate on the gateway processor (for example CAN-to-Ethernet bridging, CAN tunneling over Ethernet, SOME/IP translation). Options: CAN-to-Ethernet bridging, CAN tunneling over Ethernet, Protocol translation to SOME/IP, Other
    • Which AUTOSAR stack variant must be supported on the gateway (specify AUTOSAR Classic Platform, AUTOSAR Adaptive, or custom middleware)? Options: AUTOSAR Classic Platform, AUTOSAR Adaptive, Custom middleware, No AUTOSAR
    • Provide the maximum allowable end-to-end latency for a bridged CAN message across the gateway prototype including serialization and PHY delays (specify in milliseconds or microseconds).
    • Indicate required diagnostic mapping behavior between CAN DTCs and Ethernet-side diagnostics for the gateway evaluations.
    • Identify who will supply or maintain the gateway reference firmware used for protocol bridging tests. Options: Your firmware team, Shared working group, We will assign later

    Ship evaluation board with reference firmware

    • Which evaluation-board form factor and external connectors do you require to integrate with your ECU test harness (for example 40-pin header, RJ45 for 100BASE-T1, OBD interface)? Options: 40-pin header, RJ45/100BASE-T1 connector, OBD connector, Custom
    • Provide the list of preloaded reference firmware features you need on delivery (for example bootloader, diagnostic CLI, CAN logger, Ethernet packet capture, power profiling utilities). Options: Bootloader, Diagnostic CLI, CAN logger, Ethernet packet capture, Power profiling
    • Specify the toolchain and version required to build the reference firmware so it matches your continuous-integration environment (for example GCC version, cross-compiler).
    • Explain how you will validate secure boot and firmware cryptographic signing behavior on the evaluation board (for example test vectors, HSM integration, signature verification report).
    • Where should the initial evaluation boards be shipped for on-site testing (for example your integration lab, an accredited third-party lab, or a designated pilot line)? Options: Your integration lab, Third-party test lab, Pilot production line

    Deliver AUTOSAR-compliant driver and diagnostic stack

    • Which AUTOSAR release and platform must drivers conform to (specify release number and Classic or Adaptive platform)?
    • Specify the diagnostic services and UDS (Unified Diagnostic Services) mapping required for the driver stack on your ECU.
    • Provide the acceptable ECU boot-time budget with the AUTOSAR stack present on the evaluation board (specify in milliseconds). Options: < 100 ms, 100-500 ms, > 500 ms, Custom
    • Which integration artifacts must accompany the driver package (for example ARXML, RTE configuration, BSW mapping)? Options: ARXML files, RTE configuration, BSW mapping, Build scripts
    • Who will own integration of the AUTOSAR stack into your existing ECU runtime environment (RTE)? Options: Your integration team, Joint integration team, We will assign later

    Deliver unified diagnostic interface firmware package

    • List the diagnostic transports that must be supported by the unified diagnostic interface (for example CAN, CAN FD, Diagnostics over IP (DoIP)). Options: CAN, CAN FD, DoIP (Diagnostics over IP), LIN
    • Provide the expected format for DTC root-cause traceability in diagnostic logs produced by the firmware (for example JSON trace, ASTM-like matrix, proprietary CSV).
    • Which transport-layer security requirements apply to DoIP sessions on the evaluation board (for example TLS version, mutual authentication, certificate management)? Options: TLS 1.2, TLS 1.3, Mutual TLS required, No TLS required
    • Do you require a hosted web-based diagnostic portal bundled with the firmware for remote analysis of captured sessions? Options: Yes, No
    • Who will maintain firmware updates, packaging, and over-the-air (OTA) delivery format for the diagnostic interface during the evaluation period? Options: Your SW team, Shared SW maintenance, We will assign later

    Deliver AEC‑Q100 production parts and qualification kit

    • Which AEC-Q100 device grade and temperature range do you require for your program (specify grade and min/max temperature)? Options: Grade 0 (‑40 to 150°C), Grade 1 (‑40 to 125°C), Grade 2 (‑40 to 105°C), Custom
    • Provide the production-qualification sample count and lot distribution you require for vehicle-level validation (for example number of DUTs per lot and number of lots).
    • What acceptance criteria will confirm the production parts meet AEC-Q100 stress tests such as temperature cycle, HAST, and mechanical shock?
    • Specify the traceability and labeling data that must accompany each qualification kit lot (for example lot code, wafer fab traceability, date code).
    • Who will run or witness the AEC-Q100 qualification tests and where should those tests be performed (for example your lab, third-party lab, or supplier fab)? Options: Your lab, Third-party lab, Supplier fab, Witness by joint team

    Provide ISO 26262 safety documentation package

    • What ISO 26262 target Automotive Functional Safety level (ASIL) must the documentation support for the device (for example ASIL A, B, C, or D)? Options: ASIL A, ASIL B, ASIL C, ASIL D
    • Which safety artifacts must be included in the package (for example Safety Manual, FMEDA, Safety Plan, Safety Case)? Options: Safety Manual, FMEDA, Safety Plan, Safety Case, All listed
    • Provide the contact and role of the safety owner or assessor who will accept the FMEDA and related safety artifacts.
    • How must traceability between hardware failure modes and system-level safety goals be presented (for example FMEA matrix, requirements traceability matrix)? Options: FMEA matrix, Requirements traceability matrix, Other
    • When do you need the ISO 26262 package delivered relative to your platform freeze date (for example at evaluation start, before silicon selection, or before design lock)? Options: At evaluation start, Before silicon selection, Before design lock

    Deliver silicon errata and board-level workaround kit

    • List the categories of silicon errata you need proactively documented before design lock (for example timing, PHY inrush, ECC limitations, boot ROM issues). Options: Timing, PHY inrush, ECC limitations, Boot ROM issues, Other
    • Provide the form you expect board-level workaround guidance to take (for example schematic change, BOM change, firmware patch note, measured regression tests). Options: Schematic change, BOM change, Firmware patch note, Regression test report
    • What evidence will validate that a board-level workaround resolves the erratum on your evaluation board (for example reproducible test steps, regression test vectors, sign-off report)?
    • Estimate the maximum acceptable impact window for an erratum resolution measured from report to confirmed workaround (specify in calendar months). Options: < 1 month, 1-3 months, 3-6 months, > 6 months
    • Name the escalation contact and preferred SLA for critical errata in your program.

    Deliver EMC-hardened reference PCB layout and filter kit

    • Which EMC standards must the reference PCB layout target for vehicle-level radiated and conducted emissions testing (for example CISPR 25, ISO 11452)? Options: CISPR 25, ISO 11452, Both CISPR 25 and ISO 11452, Other
    • Provide the specific filter components and recommended placement constraints you require in the filter kit (for example common-mode choke value ranges, capacitor types, recommended footprints).
    • Specify the chassis and cable-harness configurations that must be considered when validating the reference PCB in EMC tests. Options: Vehicle chassis mimic, Standard harness length (1 m), Custom harness - specify
    • How will you measure EMC radiated emissions on the delivered reference PCB (for example pre-compliance chamber, accredited test lab, and acceptance limits)? Options: Pre-compliance chamber, Accredited test lab, Internal EMI bench
    • Do you require Gerber, ODB++, and placement files compatible with a specific PCB CAD tool (specify tool if required)? Options: Yes - specify tool, No - generic Gerber ok

    Deliver sleep-mode power profiles and firmware tuning

    • Provide the target sleep-mode current per ECU you expect measured on the evaluation board (specify value in microamperes, uA).
    • Which sleep-entry and wake-up sequences must the firmware support during power characterization (for example CAN wake from bus activity, LIN wake, magic packet over Ethernet)? Options: CAN bus wake, LIN wake, Ethernet magic packet, GPIO wake
    • How will you accept measured sleep-mode power results (for example a power measurement report with test jig description, averaging method, and sample count)?
    • Specify the allowed wake-up latency budget from sleep to full ECU operation required by your integration tests (specify in milliseconds). Options: < 10 ms, 10-100 ms, > 100 ms, Custom
    • Who will run the power characterization and provide measurement fixtures and logs during the evaluation phase? Options: Your power lab, Third-party power lab, Supplier provides data
  4. Hardware Evaluation

    Run hands-on benchmarking and interoperability tests against agreed acceptance criteria on evaluation boards and gateway prototypes to validate silicon for the platform program.

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  5. Mutual Commit

    Finalize commercial terms, part qualification milestones, errata handling protocols, and long-term supply commitments required for production sign-off.

    Agreement Modules

    • Purchase Agreement
    • Order Confirmation
    • Part Qualification Milestone Schedule
    • Errata & Workaround Protocol
    • Long-Term Supply Agreement
    • Price & Volume Commitment Schedule
    • Automotive Compliance Addendum
    • Change Control & Obsolescence Policy
    • Production Acceptance Certificate
    • Warranty & Returns
  6. Integration & Launch

    Operationalize integration, qualification, and production readiness by locking readiness facts and configuration values before execution.

    1. Integration Readiness

      Confirm owners, test environments, timelines, access, and go/no-go criteria required for system integration and qualification activities.

      Pre-Deployment Questions

      Environment and site access

      • List the target integration environments and physical sites we will use (e.g., integration lab, EMC chamber, pilot production line). Name each environment exactly as your team refers to it — this lets us book resources and route deliverables.
      • Are required test facilities and benches reserved for the planned integration window (integration lab, EMC chamber, HIL, gateway bench)? If not, when will reservations be confirmed (date)? — so we can lock test slots. Options: Yes — all reserved, Partially reserved (some environments), No — reservations pending, Not applicable (single-site remote)
      • Does the integration team have the necessary access to each environment (badge/physical entry, VPN/remote console, lab network VLAN) or is access outstanding? If outstanding, when will access be granted? Options: Access in place for all environments, Access pending for some environments, No access yet — need assistance, Not required (vendor-managed lab)

      Data and configuration

      • Has the integration configuration baseline been agreed (pin mappings, PHY settings, firmware baselines, diagnostic interfaces, test-harness parameters)? This baseline will be locked for test reproducibility. Options: Yes — baseline agreed, Partial — some items open, No — baseline not agreed
      • Who is the owner of the reference configuration (name and role)? Provide a single person who will approve configuration changes — we will route change requests to this owner.
      • Are the required firmware builds and test-harness binaries available for the target environments? (we need to know if builds must be produced before lab time) Options: All builds available, Some builds missing, None available yet, N/A — no firmware required for this phase

      People and ownership

      • Who is the primary integration owner (name and role) that the deployment team should contact for go/no-go decisions and milestone approvals?
      • Are named owners assigned for these workstreams: EMC testing, firmware/software, hardware/PCB, system integration, quality/compliance, and supply chain? If not, select the appropriate state so we can fill gaps. Options: All workstreams have named owners, Some workstreams lack owners, No owners assigned yet

      Timing and go/no-go criteria

      • What are the target dates (calendar dates) for: first lab integration start and final qualification sign‑off? These dates drive lab bookings and sample deliveries.
      • Are the go/no-go acceptance criteria and test pass thresholds documented and approved (examples: EMC margins, worst-case latency, sleep-mode current, AUTOSAR/OPEN Alliance compliance gates)? If not, who will approve them and by when? Options: Yes — documented and approved, Documented but awaiting approval, Not documented, Approval requires vendor input
    2. Integration Configuration

      Lock exact configuration values the integration team will use — pin mappings, PHY settings, firmware versions, diagnostic interfaces, and test-harness parameters.

      Configuration Details

      Integration Configuration — Environment & Firmware

      • Integration environment name (single token; format: lower-case, no spaces; Default: pilot)
      • Gateway ECU firmware image version to lock (format: vMajor.Minor.Patch, e.g. v1.2.0; Default: v1.0.0)
      • Bootloader version to lock (format: vMajor.Minor.Patch or enter 'match firmware image version'; Default: match firmware image version)

      Pin mappings & PHY assignments

      • Primary Ethernet PHY interface type (select one; Default: 100BASE-T1) Options: 100BASE-T1, 1000BASE-T1, 100BASE-TX (legacy), None
      • Primary Ethernet port pinmap identifier (single value: enter pinmap ID or filename; format example: board_pinmap_v1.0 or /repo/board_pinmap_v1.0.json; no secrets)
      • Fallback/secondary PHY interface type (select one if applicable; Default: None) Options: 100BASE-T1, 1000BASE-T1, 100BASE-TX (legacy), None

      PHY & transceiver electrical settings

      • PHY autonegotiation for integration (select one; Default: Enabled) Options: Enabled, Disabled
      • PHY speed cap to enforce during integration (select one; Default: Auto) Options: Auto, 100 Mbps, 1000 Mbps
      • CAN transceiver termination resistance (numeric, ohms; Default: 120)

      Diagnostics, logging & interfaces

      • Diagnostic protocol for integration (select one; Default: Seller unified diagnostic interface) Options: Seller unified diagnostic interface, UDS over CAN, UDS over Ethernet (DoIP), Custom
      • Diagnostic port mapping identifier (single value: connector or board label, e.g., J1 or OBD2-A; enter the label the integration harness will use)

      Test harness parameters & acceptance thresholds

      • Test harness runner ID (single value; CI job or test-bench ID; Default: integration_eth_tests_v1)
      • Latency acceptance threshold for critical integration path (numeric, microseconds; Default: 1000)
    3. Integration & Launch

      Execute integration, ECU qualification, pilot builds, and pilot production with clear owners, sequencing, milestones, and escalation paths.

  7. Success

    Validate production readiness, review qualification outcomes against acceptance criteria, and maintain a shared channel for issues, errata workarounds, and enhancement requests.

    Success Reviews

    • Go-live Health Check (weeks 1-4)
    • First Measurement Review (weeks 4-10)
    • Acceptance Gate Meeting (≈ day 90)
    • Post-Acceptance Stabilization and Errata Burn-down (day 120-180)
    • Quarterly Operational Review (ongoing)

    Issues & Enhancements

    • Publish an errata closure tracker with expected resolution dates and test validation criteria.
    • Confirm the incumbent wind-down approach and archival actions are assigned and scheduled.
    • Publish the acceptance decision record including all test artifacts and the signatory statement.
    • If conditional acceptance, publish the remediation plan with specific tests, owners, and closure dates.
    • Execute the incumbent decommissioning tasks or document the read-only retention plan and archive locations.
    • Errata status and burn-down plan
    • Reduce open silicon errata to the agreed target and document expected resolution dates for remaining items.
    • Confirm pilot production yield meets or has a clear remediation plan relative to Integration & Launch targets.
    • Agree specific firmware or board-change deliverables and verification windows for closure.
    • Reconfirm acceptance criteria and owners
    • Schedule firmware and board-change verification windows and reserve pilot build slots for re-validation.
    • Produce a supply-risk mitigation plan for any long-lead components flagged as at-risk.
    • Production incidents and trend analysis
    • Keep high-severity incident rate trending down and ensure no critical regressions remain open.
    • Maintain a declining count of open errata workarounds with clear closure dates.
    • Validate that supply forecast meets the production ramp needs or document agreed mitigation actions.
    • Update the incident and errata dashboards with remediation status and open action owners.
    • Deliver a quarterly supply-risk report highlighting any changes to committed allocations.
    • Document any agreed escalation steps for high-priority engineering changes.
    • All acceptance criteria from Evaluation Scope are confirmed with named owners.
    • Critical deployment blockers are identified and have assigned remediation actions with target dates.
    • Schedule and data sources for the First Measurement meeting are agreed.
    • Publish a deployment checklist status and access details for evaluation boards and prototypes.
    • Log all open blockers with severity, temporary workarounds, and target resolution dates.
    • Confirm telemetry sources and data export format for the First Measurement session.
    • Measurement methodology and data integrity
    • Confirm the first measurement dataset is valid and traceable to raw test artifacts.
    • Document corrective actions for each metric not meeting targets in Evaluation Scope, with owners and dates.
    • Confirm the expected date for the Acceptance Gate meeting and required deliverables.
    • Publish the measurement report with raw artifacts, test logs, and the reconciliation to Evaluation Scope targets.
    • Create remediation tickets for each failing metric including test plan for re-validation.
    • Schedule follow-up test windows and reserve evaluation board time for re-test runs.
    • Restate acceptance criteria from Evaluation Scope
    • Produce a documented pass/fail decision for every acceptance criterion listed in Evaluation Scope.
    • Capture a formal acceptance decision with named signatory or a documented conditional-acceptance closure plan.
    • Deployment and pilot validation
    • Open errata and workaround status
    • Present outcome data per acceptance criterion
    • Present sleep-mode current results
    • Pilot production yield review
    • Board-level workarounds and firmware patches
    • Document pass/fail per criterion
    • Supply continuity update
    • Present end-to-end latency results
    • Early operational signals
    • Supply continuity and long-lead items
    • Open issues triage
    • Diagnose gaps and root causes
    • Enhancement requests and escalation items
    • Incumbent decommissioning checkpoint
    • Immediate remediation actions and cadence
    • Agree corrective actions and timeline to acceptance gate
    • Formal acceptance decision and signatory capture
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