Technology Semiconductor & Chip Design Chip Manufacturing & Tapeout

Yield Engineering

Long-cycle design programs where IP, foundry, and ecosystem partnerships execute against tapeout and market windows.

Example organizations in this space: PDF Solutions KLA Applied Materials Onto Innovation

This interactive experience is the shipped product itself — the same application code customers run in production, mounted read-only in your browser over a real sample journey. Not a video, not a mockup: because the demo and the product are one codebase, it can never drift from the real thing.

Inside this journey
  1. Pre-Sales

    Qualify and diagnose before investing in a full evaluation cycle.

    1. Qualification

      Confirm budget range, decision authority, timeline urgency, and high-level constraints before investing in a full diagnostic cycle.

      Qualification Questions

      High-level evaluation fit and constraints

      • To make the qualification meaningful, do you have production wafer lots available for a side-by-side run with your current fleet, or would testing be limited to non-production wafers? Options: Production lots available for side-by-side qualification, Only non-production / test wafers available, Unsure — need to confirm internally
      • Roughly how many wafers or lots could you allocate to a multi-week qualification (this helps us estimate scope and tool time)? Options: Up to 50 wafers, 51–200 wafers, 201–1,000 wafers, 1,001+ wafers, Unsure
      • Which of these constraints are likely to affect an on-wafer qualification? Select all that apply. Options: Cleanroom access windows or limited tool time, Recipe or tool-change restrictions, Data-sharing, IP, or export-control restrictions, Target acceptance criteria already defined, Concern about false positives creating investigation overhead, Other (will describe below)
      • If there are any special constraints or acceptance metrics we should know now, please summarize briefly.

      Budget

      • Is there an allocated budget range for qualification and a possible tooling purchase? Options: No allocated budget yet, Under $250,000, $250,000–$1,000,000, $1,000,000–$5,000,000, $5,000,000–$20,000,000, Over $20,000,000 (major capital project)

      Authority

      • Who is the primary sign-off authority for an investment of this type, and which roles will influence the decision? Select all that apply. Options: VP or Head of Process Engineering or Yield, Director or Manager of Yield / Process Engineering, Fab Operations or Plant Manager, Procurement or Finance, Quality, Safety, or Compliance, Cross-functional committee, Unsure — need to confirm

      Timeline and next step

      • When do you need to reach a go or no-go decision on a qualification project? Options: 0–3 months (urgent), 3–6 months, 6–12 months, 12+ months, No set timeline / ongoing concern
      • Would you be open to a focused 30-minute discovery to review wafer access, acceptance criteria, and a high-level project plan? Options: Yes — please propose times, Maybe — need to check internally, No — not at this time
    2. Process & Yield Discovery

      Map current yield performance, inspection gaps, data sources (inspection, metrology, test), stakeholder roles, and target acceptance criteria.

      Discovery Questions

      Context and goals for this evaluation

      • How often does your production line run qualification tests for new inspection systems? Options: Weekly, Monthly, Quarterly, Semi-annually, Annually, Never / ad hoc
      • Describe your team's primary objective for this evaluation, name the target yield or defect reductions and the critical timeline you are working to meet.
      • When did you first notice the current yield delta versus target on this node or line? Options: Within last month, 1-3 months ago, 3-6 months ago, 6-12 months ago, Over a year ago
      • Who owns the decision to change inspection tools or analytics for this line, and who signs procurement approvals? Options: VP Process Engineering, Director of Yield Management, Fab Manager, Head of Procurement, Cross-functional steering committee, Other
      • Estimate the annual revenue impact of a 1 percentage point yield improvement on this line, choose the closest range. Options: <$1M, $1M-$10M, $10M-$50M, $50M-$100M, >$100M
      • Provide the timeline you consider acceptable for completing hands-on qualification, pick one. Options: <4 weeks, 4-8 weeks, 8-16 weeks, 16-24 weeks, >24 weeks

      Where yield problems show up, and what they cost

      • If current inline inspection had flagged the root cause earlier last quarter, how much additional yield would you have recovered and what would that have been worth annualized?
      • Quantify how often defects escape inspection and cause rework, scrap, or customer escapes today. Options: >5% of lots, 1-5% of lots, 0.1-1% of lots, <0.1% of lots, Unknown / not tracked
      • List the top defect types on this node that are hardest to classify or correlate to process parameters.
      • Identify which downstream indicator increases most reliably after an undetected defect escapes, choose one. Options: Metrology shifts, Electrical test failures, Customer returns or escapes, Yield trending variance, Other
      • Tell us which teams are pulled into investigations when an unexplained yield loss happens, pick all that apply. Options: Process engineering, Yield engineering, Tool maintenance, Quality, Test engineering, Operations, Other
      • What single data gap or inspection blind spot would cause you to halt qualification immediately?

      Where the current inspection chain breaks down

      • Describe the most recent incident when an inspection or classifier failed to flag a defect that later showed up in electrical test, and list the immediate actions taken.
      • Who was first alerted by that failure and how long before escalation reached leadership? Options: Operator, Line engineer, Yield engineer, Shift manager, Automated monitoring alert, Other
      • Which inspection mode or tool in your current fleet tends to miss the smallest or newest feature sizes? Options: Optical wafer inspection, E-beam review, SEM review, Inline metrology, Existing classifier mode, Other
      • How long does it typically take from suspect defect detection to a root-cause hypothesis being shared with process engineering? Options: <1 day, 1-3 days, 1 week, 2-4 weeks, >4 weeks
      • Explain the classification accuracy threshold your team requires before engineering will act on a new classifier's findings. Options: >99%, 97-99%, 95-97%, 90-95%, <90% or none defined
      • If inspection exports are not available in machine-readable format within two weeks, what happens to your decision timeline? Options: Project delayed, Manual extraction required, Alternate data used, Pilot canceled, Unknown

      Hidden costs and timeline risks that change the decision

      • Assuming classifier accuracy could improve to 95 percent on novel defect types with fewer than 50 labeled images, what process you run today would you change first?
      • Estimate the engineering hours saved per week if false positives fell by half on this line, pick a range. Options: <5 hours, 5-20 hours, 20-50 hours, 50-100 hours, >100 hours
      • Rank the top three cost drivers when a false defect detection forces a deep investigation, select up to three. Options: Investigation engineering time, Wafer scrapping, Equipment downtime, Customer impact rework, Classifier re-training, Cross-team meetings
      • List typical schedule slips you see during recipe development and validation for a new inspection tool.
      • Name the single highest-cost integration or validation task you expect during production rollout, pick one. Options: Recipe development, Classifier training, Automation integration, Cleanroom scheduling, Electrical correlation tests, Other
      • Are there contractual or capital hurdles that would prevent you from starting a tool qualification this quarter? Options: Yes, capital approval pending, Yes, procurement process longer than quarter, No, approvals in place, Unsure

      The other routes you are actively weighing

      • Compare the options you are actively considering, including staying with the incumbent, an internal build, or a third-party inspection plus analytics partner. Options: Stick with incumbent inspection fleet, Upgrade incumbent software, Buy new inspection tool from vendor, In-house analytics build, Third-party inspection and analytics partner, Other
      • Which evaluation criteria matter most to you right now, select up to three. Options: Capture rate, Classification accuracy, Integration speed, Total cost of ownership, Training data needs, Support and SLA, Time to value
      • Do you have a preferred incumbent you expect to requalify with if nothing else changes? Options: Yes, No, Undecided
      • Identify whether anyone on your team has proposed solving this internally instead of working with an outside vendor. Options: Yes, engineering proposed build, No one proposed build, Multiple proposals including build, Unknown
      • Provide the timeline or contractual condition that would keep you committed to your current supplier for this line. Options: Contracted through next quarter, Contracted through next fiscal year, Decision tied to meeting yield targets, No binding contract or easy to change
      • What would have to be true of your incumbent approach for you to stay with it rather than switch to a new inspection and analytics partner?

      Acceptance metrics that make this a clear yes

      • Pinpoint the top three metrics that would prove a pilot successful for you and rank them by importance.
      • Give the numeric target for defect capture rate you require to consider switching inspection tools, pick one range. Options: >99%, 98-99%, 95-98%, 90-95%, <90% or no target
      • Choose the acceptable false-detection rate ranges for qualification, pick one. Options: <0.1%, 0.1-0.5%, 0.5-1%, 1-2%, >2%
      • Specify how many production wafers or inspection hours you require in a hands-on qualification, pick the closest band. Options: <10 wafers, 10-50 wafers, 50-200 wafers, 200-1000 wafers, >1000 wafers
      • Project how quickly, after meeting acceptance criteria, you expect to move to procurement and install, choose one. Options: Within 2 weeks, 2-4 weeks, 1-2 months, 3+ months, Depends on budget cycle
      • Do the acceptance targets you just specified, if met, allow your team to release purchase approvals or change tool fleet within 30 days? Options: Yes, approvals path exists, Yes with expedited approval, No, longer approvals needed, Unsure

      Operational readiness and hard constraints

      • Confirm which data feeds must be available for the qualification to proceed and who owns each feed, pick all that apply. Options: Inline inspection images, Metrology logs, Equipment sensor logs, Electrical test data, Run recipes and process logs, Operator logs
      • Name the owner or role who will serve as single-point contact for data access and API credentials, pick the role. Options: Process engineering lead, Yield engineering lead, IT / data engineering, Fab operations manager, Procurement rep, Other
      • Explain the current state of your defect and metrology data, is it labeled, time-stamped, and linked by wafer id? Options: Fully labeled and linked by wafer id, Partially labeled, some linkage, Raw but timestamped only, Multiple siloed datasets, Unknown
      • Are there regulatory, safety, or cleanroom access approvals that typically take longer than four weeks for new tool work? Options: Yes, typically longer than four weeks, No, approvals under four weeks, Sometimes, depends on tool, Unknown
      • Quantify the headcount and skills you can dedicate to classifier training and recipe development in the next quarter, pick one. Options: <1 FTE, 1-2 FTEs, 3-5 FTEs, 6-10 FTEs, >10 FTEs
      • Would a missing named owner for cleanroom access or data exports stop the project before it starts? Options: Yes, project cannot start, It would delay start, No, we can assign quickly, Unknown

      Integration, data flow, and timing to production

      • Outline the end to end data flow you expect between inspection, metrology, equipment logs, and test data during a pilot.
      • Confirm which export or API methods are available for the systems you listed, select all that apply. Options: APIs available, CSV or flat file exports available, Manual export only, No export method, Unknown
      • Rank the integration tasks by difficulty and select up to three that you expect to be the hardest. Options: Data mapping and schema alignment, Real-time streaming setup, Authentication and credentialing, Data volume handling and storage, Correlation across wafer IDs, Validation test plan creation
      • Walk through a typical timeline from sample wafers available to completed qualification, include gating decisions and expected durations.
      • Summarize the data security or anonymization constraints that must be met before raw wafer data can leave your network, select all that apply. Options: No special needs, On-premise only processing, Anonymize site and PII identifiers, Encrypted transfer only, Legal review required before sharing
      • When the pilot shows the required capture and classification numbers, who has authority to approve scaling to production within your organization? Options: VP Process Engineering, Director Yield Management, Fab Manager, Capital procurement committee, Cross-functional steering committee

      Decisive next steps and timing

      • Assuming the pilot hits targets, what internal approvals or purchase triggers must happen before you can sign a statement of work, select all that apply. Options: Capital approval, Procurement review, Legal contract review, Executive sign-off, None, delegated authority
      • Share preferred timing windows for starting classifier training and tool integration within the next quarter, pick one. Options: Immediately, Within 2 weeks, Within 4-8 weeks, Next quarter, No current window
      • Choose the procurement or capital route you would use for a new inspection tool, pick one. Options: CapEx purchase, Lease or finance, Operational expense subscription, Pilot to buy staged payment, Other
      • Pinpoint which leaders need to see pilot results and what form of evidence moves them, list title and required deliverable for each.
      • Will your organization commit to a defined qualification wafer schedule within 30 days if the pilot meets the agreed acceptance metrics? Options: Yes, committed, Yes with conditions, No, cannot commit, Need to confirm
  2. Solution Evaluation

    Run hands-on qualification on production wafers to measure defect capture rates and classification accuracy against agreed acceptance criteria.

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  3. Solution Scope

    Define hardware, analytics, integration modules, timelines, acceptance metrics, responsibilities, and risk mitigations for qualification and production integration.

    Scope Configuration

    • Install and commission wafer inspection tools
    • Develop and deploy inspection recipes
    • Configure defect classification stations
    • Rapid few-shot defect classifier training
    • Integrate inspection data with metrology logs
    • Correlate inspection data with wafer electrical test
    • Run production qualification and capture validation
    • Deploy root-cause hypothesis engine and dashboards
    • On-site operator training and workflow handover
    • False-positive reduction and detection tuning
    • Migrate historical defect records to platform
    • Integrate feedback to process control systems
    • Capital financing and incentive qualification support

    Scope Questions

    Install and commission wafer inspection tools

    • Which inspection tool model(s) and probe station interfaces will be installed (list tool IDs or line numbers)?
    • How many tools and chassis do you plan to commission on-site during this engagement? Options: 1, 2-3, 4-6, 7+
    • Where in the fab will each tool be located (fab ID, line, and cleanroom class)?
    • Who will provide equipment electrical, compressed air, and exhaust hookups and confirm single-line diagram (SLD) readiness?
    • When can we schedule lockout/tagout (LOTO) and tool-floor access windows for physical installation? Options: Within 2 weeks, 2-4 weeks, 4-8 weeks, TBD
    • How will you validate tool acceptance on delivery (e.g., vibration checks, kinematic alignment report, tool serial numbers)?

    Develop and deploy inspection recipes

    • Which process layers and reticle IDs must initial recipes cover (example: poly, active, metal1, via stacks)?
    • How many production wafer lots per layer are available for recipe tuning during qualification? Options: <5 lots, 5-20 lots, 21-50 lots, 50+ lots
    • Who will own recipe sign-off for each layer (name and role on your team)?
    • What time budget should we assume for recipe development per layer (days)? Options: 1-3 days, 4-7 days, 8-14 days, Custom
    • Which process control limits or acceptance windows from your process control plan should recipes respect (e.g., CD tolerance, overlay thresholds)?
    • Indicate any locked recipes or tool recipes that cannot be changed during the engagement and must be integrated instead of modified. Options: None, Some layers locked, All recipes locked, TBD

    Configure defect classification stations

    • Which classifier deployment mode do you prefer for station configuration: local workstation, on-prem server, or cloud-edge hybrid? Options: Local workstation, On-prem server, Cloud-edge hybrid, Undecided
    • How many parallel classification stations are required to match your wafer throughput targets (units per shift)?
    • What file formats and metadata schema must the station accept from the inspection tool (example: proprietary wafer map + JSON with die coordinates)?
    • Who is the named owner for classifier configuration and maintenance on your team (name, role, contact)?
    • Which defect label taxonomy should the station use (provide the layer-specific defect classes or reference document)?
    • Specify the network and security requirements for classifier station integration (e.g., VLAN, firewall ports, certificate provision).

    Rapid few-shot defect classifier training

    • What minimum classifier accuracy on novel defect classes measured on held-out production dies will you accept as a go/no-go threshold? Options: 85%, 90%, 95%, Custom
    • How many labeled examples per novel defect class can you provide during training runs (actual wafer captures or SEM images)? Options: <10, 10-25, 26-50, 50+
    • Which imaging modalities will you supply for training (optical brightfield, darkfield, SEM images, EDX overlays)? Options: Optical brightfield, Optical darkfield, SEM, EDX, Other
    • Who will perform the initial label validation on training images and provide disputed-label resolution?
    • What turnaround time do you require from initial image submission to an updated classifier deployed on a station? Options: <24 hours, 24-72 hours, 3-7 days, Custom
    • Specify any regulatory or internal data handling rules for training images (e.g., IP redaction, export controls).

    Integrate inspection data with metrology logs

    • Which metrology systems and data types must be correlated (CD-SEM, ellipsometer, AFM, film-thickness logs)?
    • How frequently must inspection results be joined with metrology records (real-time, hourly batch, daily batch)? Options: Real-time, Hourly batch, Daily batch, Weekly
    • What identifier will be used to join records (wafer ID, lot ID, die coordinates, mask set ID)? Options: Wafer ID, Lot ID, Die coordinates, Mask set ID, Other
    • Who manages metrology data exports and can provide sample CSV/CSV schema and a recent data extract for mapping?
    • Specify data retention and time-range for correlation (e.g., last 6 months of metrology runs, lifetime of a lot).
    • Are there any calibration or timestamp synchronization constraints between inspection logs and metrology equipment we should plan for? Options: Yes, No

    Correlate inspection data with wafer electrical test

    • Which electrical test outputs must be linked (parametric test logs, yield maps, failing vector IDs)?
    • How will electrical test results be exposed for ingestion (file export, API, direct DB access)? Options: File export, API, Direct DB access, Other
    • What wafer traceability fields exist on your test floor to match inspected dies to electrical test results (probe card ID, handler serial, wafer slot)?
    • Who from your test engineering team will validate correlation hypotheses between defect density and failure modes?
    • Specify the acceptable latency between inspection capture and availability of electrical test data for correlation workflows. Options: Same shift, Next shift, 24-72 hours, Custom
    • Indicate any restrictions on sharing failing vector contents or test program source code for root-cause analysis. Options: No restriction, Restricted with NDA, Cannot share

    Run production qualification and capture validation

    • What defined acceptance metrics will confirm successful qualification (specific defect capture rate delta, classifier precision/recall thresholds, throughput targets)?
    • How many qualification lots and wafer samples must be processed to satisfy your production acceptance protocols? Options: 1-3 lots, 4-10 lots, 11-25 lots, 25+ lots
    • Who is authorized to sign the final qualification acceptance and provide the official production handover document?
    • When do you require qualified tools to be available for production (target calendar date)?
    • Which KPI reports and evidence artifacts do you require for validation (wafer-level maps, ROC curves, SEM validation images)?
    • Are there specific false-positive or false-negative thresholds tied to production release for particular layers or test programs?

    Deploy root-cause hypothesis engine and dashboards

    • Which dashboards and KPIs do you need on day one (defect density by die, layer heatmaps, trend of defect classes by lot)?
    • How frequently should the hypothesis engine rerun correlations between inspection, metrology, and test logs (on-demand, nightly, hourly)? Options: On-demand, Nightly, Hourly, Real-time
    • Who are the named dashboard consumers (yield engineer, process owner, fab manager) and what access levels do they require?
    • What alerting thresholds and notification channels should the platform use when a new root-cause hypothesis crosses confidence thresholds? Options: Email, SMS, Operations dashboard, Ticketing integration
    • Specify any existing visualization templates or corporate report formats the dashboards must conform to.
    • Indicate whether the hypothesis engine needs to preserve audit trails for each automated hypothesis run for regulatory or quality review. Options: Yes, No

    On-site operator training and workflow handover

    • How many operators and engineers require hands-on training sessions for inspection and classification workflows? Options: 1-3, 4-10, 11-25, 25+
    • Which shift patterns must training cover (day shift only, all three shifts, weekends included)? Options: Day shift only, Two shifts, All three shifts, Custom
    • Who will be the named workflow owner responsible for day-to-day operations after handover?
    • What operator certification artifacts do you require at handover (checklists, signed runbooks, competency sign-offs)?
    • When should shadowing and paired-run sessions be scheduled relative to tool commissioning? Options: During commissioning, After commissioning, Before commissioning, TBD
    • Specify any language, safety, or cleanroom training prerequisites operators must complete before we deliver on-site sessions.

    False-positive reduction and detection tuning

    • Which defect classes currently generate the highest false-positive investigation load (list by layer and defect label)?
    • How many engineering hours per week can you allocate to iterative tuning and manual review during the tuning window? Options: <5 hours, 5-15 hours, 16-40 hours, 40+ hours
    • What target reduction in false-positive rate is required to consider tuning successful (percent or absolute volume reduction)?
    • Who will adjudicate borderline calls during tuning and provide final labels for retraining?
    • Which automated pre-filters or recipe-level thresholds are allowed to be altered to reduce false positives (give layer-specific allowances)?
    • Are there any defect classes where false-positive suppression is not permitted due to safety or yield risk? Options: Yes, No
  4. Mutual Commit

    Finalize commercial terms, data-access authorizations, warranty and service commitments, and the acceptance criteria that trigger payment or handover.

    Agreement Modules

    • Purchase Agreement
    • Order Form & Payment Schedule
    • Software License & Hosting Agreement
    • Master Services Agreement (MSA)
    • Statement of Work (SOW)
    • Service Level Agreement (SLA) & Warranty Addendum
    • Acceptance Test Plan and Payment Trigger
    • Data Processing and Access Agreement (DPA)
    • Change Order Agreement
  5. Deployment

    Lock readiness facts and configuration values before execution begins.

    1. Pre-Deployment Readiness

      Capture concrete readiness facts — wafer schedules, cleanroom access, safety approvals, data feeds, and named owners required before execution.

      Pre-Deployment Questions

      Environment and site access

      • Primary deployment site and cleanroom room(s) where equipment will be installed (name the fab site and room). This tells us where to schedule onsite teams.
      • Cleanroom access status for the seller's field engineers (badges, escorted access, required training). Choose the current state so we can plan lead time. Options: Approved — badges/training complete, Partial — escorts or limited areas only, Pending — request submitted; approval date TBD, No — access not arranged; buyer will coordinate
      • Site facilities readiness for install (power circuit availability, cleanroom load/rack space, and network access for telemetry). State exactly: 'Ready', 'Partial — list constraint', or 'Not ready'.

      Data and integration

      • Which data feeds will be accessible at deployment start (select all that apply). These feeds are required for qualification and analytics. Options: Inspection defect stream (inline inspection), Metrology batch/log exports, Equipment sensor logs (tool telemetry), Electrical test result files, None — feeds not available at start, Other (specify in next field)
      • Named owner(s) for data access and approvals (inspection, metrology, test). Provide name, role, and primary contact so we can request access.
      • Integration readiness for third-party systems the platform will ingest (is an integration engineer assigned and are scoped API/transfer methods approved?). Options: Yes — integration owner assigned and method scoped, Partial — owner assigned but method pending, No — no integration owner assigned, Not applicable — no external integrations

      People and ownership

      • Named onsite deployment owner who will coordinate wafers, tool access, and daily logistics (name, role, phone/email). This person will be our single point of contact onsite.
      • Safety, change-control, or EHS approver required before install (select current state). We need the approver to be identified to schedule pre-install checks. Options: Approver identified and approvals complete, Approver identified; approvals pending, Approver not yet identified, No approvals required

      Timing and constraints

      • In-scope wafer lots or production line names for initial qualification (list per site). This defines which wafers we will schedule for qualification.
      • Blackout windows or restricted production periods in the next 90 days that would prevent install or qualification (select one). If 'Yes', we will request exact dates after submission. Options: No blackout windows in next 90 days, Yes — there are blackout windows; dates to follow, Unsure — operations to confirm
      • Earliest available start date for installation and qualification (enter a date or 'TBD'). This sets the deployment timeline baseline.
    2. Configuration Details

      Lock exact configuration values the deployment team will use — tool recipes, classifier thresholds, integration endpoints, credentials, and validation test plans.

      Configuration Details

      Environments & Endpoints

      • Production inspection instance name (enter the exact instance name the deployment will configure; format example: "prod-us-west-1")
      • Inspection API endpoint URL (enter full URL the platform will call; format: https://<host>[:port]/<path> — Default: https://inspection.platform.local/api/v1)
      • Integration endpoint type for the buyer's defect-tracking or MES system (select one) — this selects the connector type the integration endpoint will use Options: REST API (HTTPS), SFTP pull, MQTT, None

      Features & Modules (enable/disable)

      • Which modules should be enabled for this deployment? (select all that apply) Options: Wafer inspection (hardware), Defect classification engine, Analytics correlation engine (inspection+metrology+test), Realtime webhook export, Batch export (Parquet/CSV), Edge inferencing (on-tool)

      Mappings & Ownership

      • Defect class field name in the buyer's defect database or MES (enter the exact field/key the integration will map to)
      • Role that will own providing credential secrets via their secrets manager (enter role name; DO NOT paste secrets — e.g., "Yield Engineer" or "IT Integrations")

      Limits & Policies (thresholds)

      • Classifier acceptance threshold (probability between 0.0 and 1.0) used to mark a defect class as "confirmed" — Default: 0.95
      • Maximum false-detection rate allowed during qualification (percentage). Default: 2.0

      Validation & Acceptance

      • Minimum defect capture rate required for go/no-go (percentage). Default: 95
    3. Deployment Execution

      Install equipment, develop recipes, train classifiers, run qualification lots, and execute the rollout plan with clear owners and escalation paths.

    4. Go-Live Acceptance

      Formal acceptance gate: verify KPI thresholds, false-detection rates, integration stability, and obtain named sign-offs before production handover.

      Checklist items

      • Receive signed Go‑Live acceptance document from buyer's designated approver
      • Deliver final acceptance test (FAT/SAT) report and obtain dual sign‑off
      • Validate false‑detection rate test report meets agreed acceptance criteria
      • Confirm integration stability test report is complete and approved
      • Verify end‑to‑end data traceability and correlation test
      • Document and verify rollback plan and restore point
      • Obtain site safety and cleanroom approvals required for production handover
      • Handover operations runbook and escalation contact sheet with buyer acknowledgement
      • Schedule and confirm first production acceptance run with named owners
      • Resolve or formally accept mitigation for all critical open issues prior to handover
  6. Success

    Run recurring outcome reviews, track issues and enhancement requests, and maintain a shared ticketing and improvement cadence to sustain yield gains.

    Success Reviews

    • Go-live Health Check (weeks 1-4)
    • First Measurement Review (weeks 4-10)
    • 90-day Outcome Review and Incumbent Wind-down
    • Quarterly Operational Review
    • Annual Outcomes and Improvement Cadence Review

    Issues & Enhancements

    • Update the ticket backlog with prioritized fixes and target completion dates.
    • Establish the remediation timeline and single owner-less task list for any outstanding high-severity items.
    • Archive or migrate incumbent system data and record the archive location in the shared workspace.
    • Disable write access to the incumbent workflow or formally set it to read-only per the wind-down decision.
    • Publish the 90-day outcome packet with metric dashboards, unresolved ticket list, and remediation timeline.
    • Operational metrics and trends
    • Confirm ongoing operational health by reviewing classification accuracy and mean time-to-root-cause trends.
    • Agree the prioritized list of operational fixes and enhancements for the next quarter.
    • Ensure ticket burn-down is progressing and set corrective steps if it is not.
    • Re-confirm success criteria and owners
    • Schedule the next classifier retraining or recipe freeze window based on prioritized fixes.
    • Publish a one-page operational health snapshot to the shared workspace after the meeting.
    • 12-month outcomes summary
    • Validate whether the solution sustained the agreed yield improvements and false-detection targets over 12 months.
    • Document persistent systemic issues and agree a mitigation or investment plan for each.
    • Set the year-ahead maintenance schedule, classifier audit cadence, and ticketing SLAs.
    • Publish the annual outcomes report with metric dashboards and the agreed maintenance calendar.
    • Schedule the annual classifier audit and any required recipe validation lots.
    • Formalize ticket triage rules and target SLAs for the upcoming year in the shared operations playbook.
    • Confirm deployment components (tools, data feeds, integrations) are live and functioning to the baseline checklist.
    • Identify and log the top 3 operational blockers with resolution dates in the shared ticketing system.
    • Agree immediate remediation actions and the timing for the first measurement meeting.
    • Publish and circulate the go-live health summary to the shared workspace within 24 hours.
    • Log all identified blockers in the shared ticketing system and assign target resolution dates.
    • Schedule targeted troubleshooting sessions for any critical integration or recipe failures discovered.
    • Present measured data vs targets
    • Determine whether defect capture rate and classifier accuracy are trending toward the Solution Evaluation stage targets.
    • Produce a short remediation plan with discrete tasks and resolution dates for any metric gaps.
    • Confirm the timeline and prerequisites for the acceptance gate in the onboarding window.
    • Publish the first-measurement report, including per-lot metrics and exemplar images, to the shared workspace.
    • Create classifier retraining and recipe-adjustment tasks in the ticketing system with target dates.
    • Schedule the follow-up diagnostic session to validate corrective actions before the acceptance window.
    • Present 90-day outcome data
    • Confirm which outcome metrics meet the Solution Evaluation stage targets and which require remediation.
    • Complete the incumbent wind-down checklist, ensuring data archive or migration and closure of dual-work workflows.
    • Deployment and integration validation
    • Root-cause diagnosis for metric gaps
    • Persistent root causes and systemic risks
    • Document per-metric status and remediation items
    • Ticket and enhancement backlog review
    • Incumbent system wind-down checklist
    • Ticketing and improvement cadence assessment
    • Agree corrective actions and timelines
    • Prioritize next-quarter fixes
    • Early adoption and usage signals
    • Open issues, risk register, and remediation timeline
    • Open issues and blockers
    • Agree year-ahead maintenance and improvement plan
    • Confirm timeline to acceptance gate
    • Integration stability and data feed health
    • Immediate remediation actions
    • Shorten meeting if no changes
    • Agree next cadence and owners for ongoing tracking
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